Lenovo ThinkSystem SD630 V2 ServerProduct Guide

Abstract

The Lenovo ThinkSystem SD630 V2 is a dense and economical two-socket server in a 0.5U rack form factor. Combining the efficiency and density of blades with the value and simplicity of rack-based servers, the SD630 V2 delivers a cost-efficient scale-out platform that is thermally designed to deliver maximum performance in the smallest footprint. The solution consists of a 2U ThinkSystem DA240 Enclosure containing up to four front-access SD630 V2 servers (nodes). Each node incorporates two third-generation Intel Xeon Scalable processors.

This product guide provides essential presales information to understand the SD630 V2 node and DA240 enclosure, their key features and specifications, components and options, and configuration guidelines. This guide is intended for technical specialists, sales specialists, sales engineers, IT architects, and other IT professionals who want to learn more about the SD630 V2 and consider its use in IT solutions.

Change History

Changes in the April 21, 2021 update:

Introduction

The Lenovo ThinkSystem SD630 V2 is a dense and economical two-socket server in a 0.5U rack form factor. Combining the efficiency and density of blades with the value and simplicity of rack-based servers, the SD630 V2 delivers a cost-efficient scale-out platform that is thermally designed to deliver maximum performance in the smallest footprint. The solution consists of a 2U ThinkSystem DA240 Enclosure containing up to four front-access SD630 V2 servers (nodes). Each node incorporates two third-generation Intel Xeon Scalable processors.

The SD630 V2 is well suited for workloads ranging from cloud, analytics to AI and high performance computing application like Computer Aided Engineering (CAE) or Electronic Design Automation (EDA).

The following figure shows four ThinkSystem SD630 V2 servers installed in a DA240 Enclosure.

Four ThinkSystem SD630 V2 servers installed in a DA240 Enclosure
Figure 1. Four ThinkSystem SD630 V2 servers installed in a DA240 Enclosure

Did you know?

The SD630 V2 combines the efficiency and density of blades with the value and simplicity of rack-based servers. With high-performance features such as high-core-count Xeon Platinum processors and high-performance 200Gb Ethernet, HDR InfiniBand and OPA fabrics, to power through your most demanding HPC, technical computing and AI workloads.

Key features

Lenovo ThinkSystem SD630 V2 is based on our fourth generation dense server platform leveraging two 3rd Gen Intel Xeon Scalable processors with NVIDIA HDR InfiniBand networking.

The SD630 V2 is designed to provide highest air-cooled CPU performance density adhering to industry-standards like the 19-inch rack footprint or standard 42U rack heights at 2 meters. To truly support every scale, it is available starting at a single node within a single Enclosure in the rack to thousands of clustered nodes in hundreds of racks in the datacenter.

The front-accessible design optimized for best-in-class thermal capabilities provides a dense, flexible solution with a low TCO. The half-wide, dual-socket server is designed for data centers that require high performance but are constrained by floor space. By taking up less physical space in the data center, the SD630 V2 enhances density and supports the Intel Xeon Scalable Family of processors, including up to an industry-leading 250W TDP.

The ThinkSystem DA240 Enclosure is an efficient, 2U rack mount enclosure with no built-in networking or switching capabilities; therefore, it requires no enclosure-level management. Sensibly designed to provide shared, high-efficiency power and cooling for housed servers, the DA240 enclosure is designed to scale with your business needs.

Scalability and performance

The SD630 V2 server offers numerous features to boost performance, improve scalability, and reduce costs:

  • Each SD630 V2 server supports two third-generation Intel Xeon Scalable Family processors, 16 TruDDR4 DIMMs and a PCIe 4.0 x16 slot for high-speed I/O, and up to two drive bays, in a half-wide 1U form factor.
  • Up to 4 SD630 V2 servers are installed in the DA240 enclosure, occupying only 2U of rack space. It is a highly dense, scalable, and price-optimized offering.
  • Supports two third-generation Intel Xeon Processor Scalable processors
    • Up to 36 cores and 72 threads
    • Core speeds of up to 3.5 GHz
    • TDP ratings of up to 250W
  • The next generation of Lenovo Neptune™ Thermal Transfer Module enables market leading TDP support within the dense form factor.
  • Support for up to 16 TruDDR4 memory DIMMs operating at up to 3200 MHz means you have the fastest available memory subsystem.
  • Each processor supports 8 DIMMs, each with its own memory channel.
  • Using 128GB RDIMMs, the server supports up to 2TB of system memory.
  • Each SD630 V2 server supports either two 7mm hot-swap SSDs or a single 2.5-inch hot-swap SSD. Drives can be either SATA or high-performance NVMe drives, to maximize I/O performance in terms of throughput, bandwidth, and latency.
  • Supports two M.2 drives installed in an adapter for convenient operating system boot functions.
  • The use of solid-state drives (SSDs) instead of traditional hard disk drives (HDDs) can improve I/O performance. An SSD can support up to 100 times more I/O read operations per second (IOPS) than a typical HDD.
  • The server includes onboard Gigabit and 25 Gb Ethernet ports for cost effective networking. The server also includes a PCIe slot for additional high-speed networking.
  • One PCIe 4.0 x16 is standard. For special bid orders, the drive bays can be converted to a second PCIe 4.0 x16 slot for added I/O flexibility.
  • The server offers PCI Express 4.0 I/O expansion capabilities that doubles the theoretical maximum bandwidth of PCIe 3.0 (16GT/s in each direction for PCIe 4.0, compared to 8 GT/s with PCIe 3.0). A PCIe 4.0 x16 slot provides 64 GB/s bandwidth, enough to support a 200GbE network connection.

Manageability and security

Powerful systems management features simplify local and remote management of the SD630 V2:

  • The server includes an XClarity Controller (XCC) to monitor server availability. Optional upgrade to XCC Advanced to provide remote control (keyboard video mouse) functions. Optional upgrade to XCC Enterprise enables the additional support for the mounting of remote media files (ISO and IMG image files), boot capture, and power capping.
  • Lenovo XClarity Administrator offers comprehensive hardware management tools that help to increase uptime, reduce costs and improve productivity through advanced server management capabilities.
  • Lenovo XClarity Provisioning Manager, based in UEFI and accessible from F1 during boot, provides system inventory information, graphical UEFI Setup, platform update function, RAID Setup wizard, operating system installation function, and diagnostic functions.
  • Support for Lenovo XClarity Energy Manager which captures real-time power and temperature data from the server and provides automated controls to lower energy costs.
  • Support for industry standard management protocols, IPMI 2.0, SNMP 3.0, Redfish REST API, serial console via IPMI
  • Supports Lenovo Intelligent Computing Orchestration (LiCO), a powerful platform that manages cluster resources for HPC and AI applications. LiCO supports multiple AI frameworks, including TensorFlow, Caffe, Neon, and MXNet, allowing you to leverage a single cluster for diverse workload requirements.
  • Integrated Trusted Platform Module (TPM) 2.0 support enables advanced cryptographic functionality, such as digital signatures and remote attestation.
  • Supports Secure Boot to ensure only a digitally signed operating system can be used. Supported with SSDs and M.2 drives.
  • Industry-standard Advanced Encryption Standard (AES) NI support for faster, stronger encryption.
  • Intel Execute Disable Bit functionality can prevent certain classes of malicious buffer overflow attacks when combined with a supported operating system.
  • Intel Trusted Execution Technology provides enhanced security through hardware-based resistance to malicious software attacks, allowing an application to run in its own isolated space, protected from all other software running on a system.
  • With the SMM management module installed in the enclosure, only one Ethernet connection is needed to provide remote systems management functions for all four SD630 V2 servers and the enclosure.
  • The SMM management module has two Ethernet ports which allows a single Ethernet connection to be daisy chained across 7 enclosures and 28 servers, thereby significantly reducing the number of Ethernet switch ports needed to manage an entire rack of SD630 V2 servers and enclosures.

Energy efficiency

The SD630 V2 and the DA240 enclosure offer the following energy efficiency features to save energy, reduce operational costs, increase energy availability, and contribute to a green environment:

  • ASHRAE A2 compliance for certain configurations to enable operation in 35°C datacenters
  • Energy-efficient planar components help lower operational costs.
  • High-efficiency power supplies with 80 PLUS Platinum certifications.
  • Next Generation Lenovo NeptuneTM Thermal Transfer Module for efficient aircooling of the CPUs.
  • Intel Intelligent Power Capability powers individual processor elements on and off as needed to reduce power draw.
  • SSDs use as much as 80% less power than 2.5-inch HDDs.
  • Optional Lenovo XClarity Energy Manager provide advanced data center power notification, analysis, and policy-based management to help achieve lower heat output and reduced cooling needs.
  • Lenovo power/energy meter based on TI INA226 measures DC power both for the CPU as well as the GPU board at higher than 97% accuracy and 100 Hz sampling frequency to the XCC and can be leveraged both in-band and out-of-band using IPMI raw commands.
  • Optional Energy Aware Runtime provides sophisticated power monitoring and energy optimization on a job-level during the application runtime without impacting performance negatively.

Availability and serviceability

The SD630 V2 server and the DA240 enclosure provide many features to simplify serviceability and increase system uptime:

  • The server offers Single Device Data Correction (SDDC, also known as Chipkill), Adaptive Double-Device Data Correction (ADDDC, also known as Redundant Bit Steering or RBS) and memory mirroring for redundancy in the event of a non-correctable memory failure.
  • The server offers hot-swap drives, supporting RAID redundancy for data protection and greater system uptime.
  • The Dual M.2 Boot Adapter supports RAID-1 which enables two installed M.2 drives to be configured as a redundant pair.
  • The DA240 Enclosure supports two hot-swap power supplies, which form a redundant pair to provide availability for business-critical applications.
  • Toolless access to upgrades and serviceable parts, such as fans, adapters, CPUs, and memory.
  • Proactive Platform Alerts (including PFA and SMART alerts): Processors, voltage regulators, memory, internal storage (SAS/SATA HDDs and SSDs), fans, power supplies, RAID controllers, and server ambient and sub-component temperatures. Alerts can be surfaced through the XClarity Controller (XCC) to managers such as Lenovo XClarity Administrator, VMware vCenter, and Microsoft System Center. These proactive alerts let you take appropriate actions in advance of possible failure, thereby increasing server uptime and application availability.
  • SSDs offer significantly better reliability than traditional mechanical HDDs for greater uptime.
  • The built-in XClarity Controller continuously monitors system parameters, triggers alerts, and performs recovery actions in case of failures to minimize downtime.
  • Built-in diagnostics in UEFI, using Lenovo XClarity Provisioning Manager, speed up troubleshooting tasks to reduce service time.
  • Lenovo XClarity Provisioning Manager supports diagnostics and can save service data to a USB key drive or remote CIFS share folder for troubleshooting and reduce service time.
  • Auto restart in the event of a momentary loss of AC power (based on power policy setting in the XClarity Controller service processor)
  • Support for the XClarity Administrator Mobile app running on a supported smartphone or tablet and connected to the server through the service-enabled USB port, enables additional local systems management functions.
  • Three-year customer-replaceable unit and onsite limited warranty, 9 x 5 next business day. Optional service upgrades are available.

Components and connectors

The following figure shows the front of the DA240 Enclosure. The front view shows the four SD630 V2 nodes.

Front view of the ThinkSystem DA240 Enclosure
Figure 2. Front view of the ThinkSystem DA240 Enclosure

The following figure shows the rear of the DA240 Enclosure.

Rear view of the ThinkSystem DA240 Enclosure
Figure 3. Rear view of the ThinkSystem DA240 Enclosure

The following figure shows the front of the SD630 V2 server.

Front view of the SD630 V2
Figure 4. Front view of the SD630 V2 node

The following figure shows the internals of the SD630 V2 server identifying key components.

Internal view of the SD630 V2 compute node
Figure 5. Internal view of the SD630 V2 compute node

System architecture

The following figure shows the architectural block diagram of the SD630 V2, showing the major components and their connections.

SD630 V2 system architectural block diagram
Figure 6. SD630 V2 system architectural block diagram

Standard specifications - SD630 V2 server

The following table lists the standard specifications of the SD630 V2.

Table 1. Standard specifications - ThinkSystem SD630 V2
Components Specification
Machine type 7D1K - 3 year warranty
Form factor Half-wide, 1U compute node.
Supported enclosure ThinkSystem DA240 Enclosure, 2U high; up to 4 servers per enclosure.
Processor Two third-generation Intel Xeon Scalable processor (formerly codenamed "Ice Lake"). Supports processors up to 36 cores, core speeds of up to 3.5 GHz, and TDP ratings of up to 250W.
Chipset Intel C621A "Lewisburg" chipset, part of the platform codenamed "Whitley"
Memory 16 DIMM slots with two processors (8 DIMM slots per processor). Each processor has 8 memory channels, with 1 DIMM per channel (DPC). Lenovo TruDDR4 RDIMMs and 3DS RDIMMs are supported. DIMMs operate at up to 3200 MHz.
Persistent memory Not supported
Memory maximums Up to 2TB by using 16x 128GB 3DS RDIMMs
Memory protection ECC, SDDC (for x4-based memory DIMMs), ADDDC (for x4-based memory DIMMs, requires Intel Xeon Gold or Platinum processors) and memory mirroring.
Drive bays

The server supports one of the following:

  • 2x 7mm 2.5-inch drive bays supporting SATA or NVMe drives (configurations with 1x PCIe slot)
  • 1x 15mm 2.5-inch drive bay supporting an NVMe drive (configurations with 1x PCIe slot)

Support for up to two M.2 SSDs on an M.2 adapter.

Maximum internal storage
  • 7mm drives
    • 960GB using 2x 480GB 7mm SATA SSDs
    • 15.36TB using 2x 7.68TB 7mm SSDs
  • 15mm drives
    • 3.84TB using 1x 3.84TB 15mm NVMe SSD
Storage controller
  • 2x Onboard SATA ports (Intel VROC SATA RAID, formerly known as Intel RSTe RAID)
  • 2x Onboard NVMe ports (includes Intel VROC NVMe RAID for Intel SSDs; optional license for non-Intel SSDs)
Optical drive bays No internal bays; use an external USB drive.
Tape drive bays No internal bays. Use an external USB drive.
Network interfaces

Onboard 1 Gb Ethernet RJ45 and 25 Gb Ethernet SFP28 connectors, based on Mellanox ConnectX-4 controller. One of these ports can optionally be shared with the XClarity Controller (XCC) management processor for Wake-on-LAN (WoL) and NC-SI support.

PCIe slots One PCIe 4.0 x16 slot with low profile form factor. For special bid configurations, the server supports an additional PCIe 4.0 x16 low-profile slot in lieu of the internal drive bays.
GPU support No support.
Ports

Front: External diagnostics port, local console connector (for a breakout cable that provides one VGA port, one USB 3.1 G1 port and one DB9 serial port for local connectivity).

Additional ports provided by the enclosure as described in the Enclosure specifications section.

Cooling Supplied by the DA240 enclosure.
Power supply Supplied by the DA240 enclosure.
Hot-swap parts Drives
Systems management

Operator panel with status LEDs. Optional External Diagnostics Handset with LCD display. XClarity Controller (XCC) embedded management, XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins, and XClarity Energy Manager centralized server power management. Optional XClarity Controller Advanced and Enterprise to enable remote control functions. Lenovo power/energy meter based on TI INA226 for 100Hz power measurements with >97% accuracy.

System Management Module (SMM2) in the DA240 Enclosure provides additional systems management functions.

Video Matrox G200 graphics with 16 MB memory with 2D hardware accelerator, integrated into the XClarity Controller. Maximum resolution is 1920x1200 32bpp at 60Hz.
Security Power-on password, administrator's password, Trusted Platform Module (TPM), supporting TPM 2.0. In China only, optional Nationz TPM 2.0.
Operating systems supported Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi. See the Operating system support section for specifics.
Limited warranty Three-year customer-replaceable unit and onsite limited warranty with 9x5 next business day (NBD).
Service and support Optional service upgrades are available through Lenovo Services: 4-hour or 2-hour response time, 6-hour fix time, 1-year or 2-year warranty extension, software support for Lenovo hardware and some third-party applications.
Ambient temperature Up to ASHRAE Class A2: 10°C - 35°C (50°F - 95°F)
Dimensions Width: 215 mm (8.5 inches), height: 41 mm (1.6 inches), depth 608 mm (24 inches)
Weight Minimum: 3.9 kg (8.6 lb), maximum: 6.4 kg (14.1 lb)

Standard specifications - DA240 enclosure

The SD630 V2 servers are supported in the ThinkSystem DA240 Enclosure. The following table lists the standard specifications of the enclosure.

Table 2. Standard specifications: DA240 Enclosure
Components Specification
Machine type 7D1J - 3 year warranty
Form factor 2U rack-mounted enclosure.
Server support Up to four SD630 V2 servers per enclosure.
Servers per 42U rack Up to 84 servers in 21 enclosures per 42U rack
Up to 96 servers in 24 enclosures per 48U rack
Midplane Passive midplane provides connections to the servers in the front to the power supplies and fans at the rear. Provides signals to control fan speed, power consumption, and node throttling as needed.
System Management Module

The hot-swappable System Management Module (SMM2) is the management device for the enclosure. Provides integrated systems management functions and controls the power and cooling features of the enclosure. Provides remote browser and CLI-based user interfaces for remote access via the dedicated Gigabit Ethernet port. Remote access is to both the management functions of the enclosure as well as the XClarity Controller (XCC) in each server.

The SMM has two Ethernet ports which enables a single incoming Ethernet connection to be daisy chained across 7 enclosures and 28 servers, thereby significantly reducing the number of Ethernet switch ports needed to manage an entire rack of SD630 V2 servers and enclosures.

Ports Two RJ45 port on the rear of the enclosure for 10/100/1000 Ethernet connectivity to the SMM for power and cooling management.
I/O architecture None integrated. Use top-of-rack networking and storage switches.
Power supplies Two hot-swap power supplies, either 1800 W or 2400 W, functioning as a redundant pair. Power supplies must be identical. Power supplies require a 200-240 V ac, 50 or 60 Hz supply. Power supplies are installed at the rear of the enclosure. 80 PLUS Platinum certified. Built-in overload and surge protection.
Power cords One AC power cord for each power supply, C13 or C19 depending on the power supplies selected
Cooling Up to three 80mm hot-swap fans, N+1 redundant
Enclosure LEDs SMM has four LEDs: system error, identification, status, and system power. Each power supply has AC, DC and error LEDs. Servers have more LEDs.
Hot-swap parts Power supplies, fans, System Management Module
Limited warranty Three-year customer-replaceable unit and onsite limited warranty with 9x5/NBD coverage.
Service and support Optional service upgrades are available through Lenovo Services: 4-hour or 2-hour response time, 6-hour fix time, 1-year or 2-year warranty extension, software support for Lenovo hardware and some third-party applications.
Ambient temperature 10°C - 35°C (50°F - 95°F) (ASHRAE A2 compliant). See the Operating Environment section for more information.
Dimensions Width: 448 mm (17.6 in.), height: 87 mm (3.4 in.), depth: 922 mm (36.3 in.). See Physical and electrical specifications for details.
Weight Minimum (with one node): 24.3 kg (53.5 lb)
Maximum (with four nodes): 44.2 kg (97.4 lb)

SD630 V2 models

ThinkSystem SD630 V2 models can be configured by using the Lenovo Data Center Solution Configurator (DCSC).

Configure-to-order (CTO) models are used to create models with factory-integrated server customizations. For CTO models, two base CTO models are available for the SD630 V2 as listed in the following table, CTO1WW and CTOLWW:

  • The CTO1WW base CTO model is for general business and is selectable by choosing General Purpose mode in DCSC.
  • The CTOLWW base model is intended for High Performance Computing (HPC) and Artificial Intelligence (AI) configurations and solutions, including configurations for Lenovo Scalable Infrastructure (LeSI), and is enabled using either the HPC & AI LeSI Solutions mode or HPC & AI ThinkSystem Hardware mode in DCSC. CTOLWW configurations can also be built using System x and Cluster Solutions Configurator (x-config).

Preconfigured server models may also be available for the SD630 V2, however these are region-specific; that is, each region may define their own server models, and not all server models are available in every region.

The following table lists the base CTO models of the ThinkSystem SD630 V2 server.

Table 3. Base CTO models
Description Machine Type/Model
General purpose
Machine Type/Model
for HPC and AI
ThinkSystem SD630 V2 - 3 year Warranty 7D1KCTO1WW 7D1KCTOLWW

The following table lists the base choices for CTO configurations of the SD630 V2.

Table 4. Base for CTO models
Feature code Description
BAFQ ThinkSystem SD630 V2 Base

Enclosure models

Up to four SD630 V2 servers are supported in a DA240 enclosure.

The following table lists the base CTO models of the ThinkSystem SD630 V2 server.

Table 5. Base CTO models for the DA240 enclosure
Description Machine Type/Model
General purpose
Machine Type/Model
for HPC and AI
ThinkSystem DA240 Enclosure - 3 year Warranty 7D1JCTO1WW 7D1JCTOLWW

The following table lists the base choices for CTO configurations of the DA240 enclosure.

Table 4. Base for CTO models
Feature code Description
BAF9 ThinkSystem DA240 Enclosure Base

Processor options

The SD630 V2 supports processors in the third-generation Intel Xeon Scalable Processor family. The server supports two processors. A configuration of a single processor is not supported.

Topics in this section:

Processor options

The table below lists the processors that are supported.

Supported processors have the following features:

  • Third-generation Intel Xeon Scalable processors (formerly codenamed "Ice Lake")
  • 10 nm process technology
  • 8x DDR4 memory channels
  • 64x PCIe 4.0 I/O lanes available for PCIe and NVMe devices
  • 1.25 MB L2 cache per core
  • 1.5 MB or more L3 cache per core
  • Intel Deep Learning Boost, which provides built-in Artificial Intelligence (AI) acceleration with the Vector Neural Network Instruction set (VNNI). DL Boost and VNNI are designed to deliver significant, more efficient Deep Learning (Inference) acceleration for high-performance AI workloads.
  • Intel Hyper-Threading Technology, which boosts performance for multithreaded applications by enabling simultaneous multithreading within each processor core, up to two threads per core.
  • Intel Turbo Boost Technology 2.0, which allows processor cores to run at maximum speeds during peak workloads by temporarily going beyond processor TDP.
  • Intel Virtualization Technology (includes VT-x and VT-d), which integrates hardware-level virtualization hooks that allow operating system vendors to better use the hardware for virtualization workloads.
  • Intel Speed Select Technology, supported on some processor models, enables increased core Turbo Boost frequency on specific individual cores to maximize application performance.
  • Intel Advanced Vector Extensions 512 (AVX-512), to enable acceleration of enterprise-class workloads, including databases and enterprise resource planning (ERP).
  • Up to two Intel AVX-512 Fused-Multiply Add (FMA) units
  • Intel SGX (Software Guard Extensions) and Intel TME (Total Memory Encryption) security features
  • Two or three Intel Ultra Path Interconnect (UPI) links at up to 11.2 GT/s, to maximize inter-processor communication

Some processors include a suffix letter in the processor model number:

  • N: NFV optimized
  • T: High Tcase
  • U: Single socket
  • V: High density/low power-optimized for SaaS virtualization customers
  • P: High frequency-optimized for IaaS virtualization customers
  • Y: Speed Select
  • S: Large (512GB) SGX Enclave size
  • Q: Optimized for liquid cooling

Memory tiers: All processors support up to 6TB of memory. There are no L or M suffix processors.

Tip: In the SD630 V2, two processors are installed in the factory so there are no part numbers for field upgrades.

Table 6. Processor options
Feature
code
Description Quantity
required
BB3M Intel Xeon Gold 5315Y 8C 140W 3.2GHz Processor 2
BB30 Intel Xeon Gold 5317 12C 150W 3.0GHz Processor 2
BB35 Intel Xeon Gold 5318Y 24C 165W 2.1GHz Processor 2
BB2R Intel Xeon Gold 5320 26C 185W 2.2GHz Processor 2
BB4E Intel Xeon Gold 6326 16C 185W 2.9GHz Processor 2
BB3H Intel Xeon Gold 6330 28C 205W 2.0GHz Processor 2
BB3D Intel Xeon Gold  6334 8C 165W 3.6GHz Processor 2
BB3S Intel Xeon Gold 6336Y 24C 185W 2.4GHz Processor 2
BB3P Intel Xeon Gold 6338 32C 205W 2.0GHz Processor 2
BB3B Intel Xeon Gold 6342 24C 230W 2.8GHz Processor 2
BB2W Intel Xeon Gold 6346 16C 205W 3.1GHz Processor 2
BB2L Intel Xeon Gold 6348 28C 235W 2.6GHz Processor 2
BB2U Intel Xeon Gold 6354 18C 205W 3.0GHz Processor 2
BB2V Intel Xeon Platinum 8352Y 32C 205W 2.2GHz Processor 2
BB3R Intel Xeon Platinum 8358 32C 250W 2.6GHz Processor 2
BB3A Intel Xeon Platinum 8358P 32C 240W 2.6GHz Processor 2
BB2P Intel Xeon Platinum 8360Y 36C 250W 2.4GHz Processor 2

Processor features

The following table compares the features of the supported third-generation Intel Xeon processors.

Abbreviations used in the table:

  • TB: Turbo Boost 2.0
  • UPI: Ultra Path Interconnect
  • TDP: Thermal Design Power
  • SGX: Software Guard Extensions
  • PMem: Persistent Memory support

Table 7. Processor features
CPU
model
Cores/
threads
Core speed
(Base / TB max)
L3 cache* Max memory
speed
UPI links
& speed
TDP SGX Enclave
Size
5315Y 8 / 16 3.2 GHz / 3.6 GHz 12 MB 2933 MHz 3 / 11.2 GT/s 140W 64 GB
5317 12 / 24 3.0 GHz / 3.6 GHz 18 MB 2933 MHz 3 / 11.2 GT/s 150W 64 GB
5318Y 24 / 48 2.1 GHz / 3.4 GHz 36 MB 2933 MHz 3 / 11.2 GT/s 165W 64 GB
5320 26 / 52 2.2 GHz / 3.4 GHz 39 MB 2933 MHz 3 / 11.2 GT/s 185W 64 GB
6326 16 / 32 2.9 GHz / 3.5 GHz 24 MB 3200 MHz 3 / 11.2 GT/s 185W 64 GB
6330 28 / 56 2.0 GHz / 3.1 GHz 42 MB 2933 MHz 3 / 11.2 GT/s 205W 64 GB
6334 8 / 16 3.6 GHz / 3.7 GHz 18 MB* 3200 MHz 3 / 11.2 GT/s 165W 64 GB
6336Y 24 / 48 2.4 GHz / 3.6 GHz 36 MB 3200 MHz 3 / 11.2 GT/s 185W 64 GB
6338 32 / 64 2.0 GHz / 3.2 GHz 48 MB 3200 MHz 3 / 11.2 GT/s 205W 64 GB
6342 24 / 48 2.8 GHz / 3.5 GHz 36 MB 3200 MHz 3 / 11.2 GT/s 230W 64 GB
6346 16 / 32 3.1 GHz / 3.6 GHz 36 MB* 3200 MHz 3 / 11.2 GT/s 205W 64 GB
6348 28 / 56 2.6 GHz / 3.5 GHz 42 MB 3200 MHz 3 / 11.2 GT/s 235W 64 GB
6354 18 / 36 3.0 GHz / 3.6 GHz 39 MB* 3200 MHz 3 / 11.2 GT/s 205W 64 GB
8352Y 32 / 64 2.2 GHz / 3.4 GHz 48 MB 3200 MHz 3 / 11.2 GT/s 205W 64 GB
8358 32 / 64 2.6 GHz / 3.4 GHz 48 MB 3200 MHz 3 / 11.2 GT/s 250W 64 GB
8358P 32 / 64 2.6 GHz / 3.4 GHz 48 MB 3200 MHz 3 / 11.2 GT/s 240W 8 GB
8360Y 36 / 72 2.4 GHz / 3.5 GHz 54 MB 3200 MHz 3 / 11.2 GT/s 250W 64 GB

* L3 cache is 1.5 MB per core or larger. Processors with a larger L3 cache per core are marked with an *

Thermal restrictions by processor

Processors used in the SD630 V2 have the following thermal restrictions:

  • When operating above 30°C ambient temperature there may be performance impacts at high utilization for
    • Processors with TDP of 165 watts or lower  
  • When operating above 25°C ambient temperature there may be performance impacts at high utilization for
    • Processors with TDP of higher than 165 watts
    • Intel Xeon Gold 6334 8C 165W 3.5GHz Processor

Memory options

The SD630 V2 uses Lenovo TruDDR4 memory and supports 8 DIMMs per processor or 16 DIMMs with two processors installed. Each processor has eight memory channels with one DIMM per channel. With 128 GB 3DS RDIMMs installed, the SD630 V2 supports a total of 2 TB of system memory.

Memory operates at up to 3200 MHz, depending on the processor model selected. If the processor selected has a lower memory bus speed, then all DIMMs will operate at that lower speed.

The following table lists the memory options that are available for the server.

Lenovo TruDDR4 memory uses the highest quality components that are sourced from Tier 1 DRAM suppliers and only memory that meets the strict requirements of Lenovo is selected. It is compatibility tested and tuned to maximize performance and reliability. From a service and support standpoint, Lenovo TruDDR4 memory automatically assumes the system warranty, and Lenovo provides service and support worldwide.

Table 8. Memory options
Part number Feature code Description Maximum
supported
RDIMMs
4X77A08632 B963 ThinkSystem 16GB TruDDR4 3200MHz (2Rx8 1.2V) RDIMM 16 (8 per processor)
4X77A08633 B964 ThinkSystem 32GB TruDDR4 3200MHz (2Rx4 1.2V) RDIMM 16 (8 per processor)
4X77A08635 B966 ThinkSystem 64GB TruDDR4 3200MHz (2Rx4 1.2V) RDIMM 16 (8 per processor)
3DS RDIMMs
4X77A08636 BA62 ThinkSystem 128GB TruDDR4 3200 MHz (2S2Rx4 1.2V) 3DS RDIMM 16 (8 per processor)

The following rules apply when selecting the memory configuration:

  • In the SD630 V2, the following DIMM quantities are supported per processor: 1, 2, 4, 6, and 8. Other quantities per processor are not supported.
  • The server supports RDIMMs and 3DS RDIMMs; UDIMMs and LRDIMMs are not supported
  • Mixing RDIMMs and 3DS RDIMMs is not supported
  • Mixing x4 and x8 DIMMs is supported

For best performance, consider the following:

  • Populate memory DIMMs in quantities of 8 per processor, so that all memory channels are used.
  • Populate memory channels so they all have the same total memory capacity.
  • Ensure all memory controllers on a processor socket have the same DIMM configuration.
  • All processor sockets on the same physical server should have the same DIMM configuration.

The following memory protection technologies are supported:

  • ECC
  • SDDC (for x4-based memory DIMMs; look for "x4" in the DIMM description)
  • ADDDC (for x4-based memory DIMMs)
  • Memory mirroring

Note: Memory sparing is not supported

If memory channel mirroring is used, then DIMMs must be installed in pairs or sets of three (minimum of one pair or set of three per processor), and all DIMMs in the pair or set of three must be identical in type and size. 50% of the installed capacity is available to the operating system. Memory rank sparing is not supported.

Internal storage

The SD630 V2 supports one or two hot-swap drive bays, accessible from the front of the server. The server supports either:

  • 2x 7mm hot-swap SSDs, either SATA or NVMe
  • 1x 2.5-inch hot-swap SSDs, NVMe

The following figure shows the drive bay choices.

Configurations of the SD630 V2 node
Figure 7. SD630 V2 drive bays

The following table lists the ordering information for the drive bays. Drive bays connect to the onboard SATA and onboard NVMe ports that are connected to the Intel PCH and Processor 1 respectively, as shown in the System architecture section.

Table 9. Drive bays for the SD630 V2
Part number Feature code Description
4M17A11749 BAEX ThinkSystem SD630 V2 2x2.5'' 7mm SATA/NVMe Storage Cage 
(Part number contains two-drive cage, Y-cable for SATA, Y-cable for NVMe)
4M17A11750 BCXG ThinkSystem SD630 V2 1x2.5" NVMe Storage Cage
(Part number contains one-drive cage, NVMe cable)

M.2 drives

The SD630 V2 supports one or two M.2 form-factor SATA or NVMe drives for use as an operating system boot solution. The M.2 drives install into an M.2 adapter which in turn is installed in a dedicated slot on the system board. See the internal view of the server in the Components and connectors section for the location of the M.2 slot.

The ordering information of the M.2 adapter is listed in the following table. Supported drives are listed in the Internal drive options section.

Table 10. M.2 components
Part
number
Feature
code
Description Maximum
supported
4Y37A09740 B967 ThinkSystem M.2 2-Bay Enablement Kit for Dense Systems 1

The ThinkSystem M.2 SATA/NVMe 2-Bay Enablement Kit for Dense Systems has the following features:

  • Supports one or two M.2 drives, either SATA or NVMe
  • When two drives installed, they must be either both SATA or both NVMe
  • Supports 42mm, 60mm, 80mm and 110mm drive form factors (2242, 2260, 2280 and 22110)
  • Either 6Gbps SATA or PCIe 3.0 x1 interface to the drives depending on the drives installed
  • Uses the onboard SATA and NVMe controllers of the server
  • JBOD native support; no built-in RAID support (RAID can be enabled via Intel VROC)
  • Supports monitoring and reporting of events and temperature through I2C
  • Firmware update via Lenovo firmware update tools

Controllers for internal storage

The drives of the SD630 V2 are connected to controller on the system board:

  • Onboard SATA ports with software RAID support (Intel VROC SATA RAID, formerly known as Intel RSTe)
  • Onboard NVMe ports with software RAID support (Intel VROC NVMe RAID)

The following table lists the adapters used for the internal storage of the server.

Table 11. Internal Storage adapter support
Part number Feature code Description
Onboard SATA - Intel VROC SATA RAID (Intel RSTe)
None AVV0 On Board SATA Software RAID Mode
Onboard NVMe - Intel VROC NVMe RAID
4L47A39164 B96G Intel VROC (VMD NVMe RAID) Premium
(license upgrade - to enable RAID support for non-Intel NVMe SSDs)

The onboard SATA controller has the following features:

  • Controller integrated into the Intel PCH
  • 6 Gbps SATA host interface
  • Supports RAID-0, and RAID-1 with two drives (Intel VROC SATA RAID, previously known as RSTe)
  • Supports JBOD

The onboard NVMe support has the following features:

  • Controller integrated into the Intel processor
  • Each drive has PCIe 4.0 x4 host interface
  • Supports JBOD - Intel and non-Intel NVMe SSDs - no license required
  • Supports RAID-0 and RAID-1 (Intel VROC NVMe RAID) - Intel NVMe SSDs only

Internal drive options

The following tables list the hard disk drive and solid-state drive options for the internal disk storage of the server.

M.2 drives:

M.2 drive support: The use of M.2 drives requires an additional adapter as described in the M.2 drives subsection.

Table 12. 2.5-inch hot-swap PCIe 4.0 NVMe SSDs
Part number Feature Description Maximum
supported
2.5-inch SSDs - U.2 PCIe 4.0 NVMe - Mainstream (3-5 DWPD)
4XB7A17152 BCFV ThinkSystem U.2 Intel P5600 1.6TB Mainstream NVMe PCIe 4.0 x4 Hot Swap SSD 1
4XB7A17153 BCFR ThinkSystem U.2 Intel P5600 3.2TB Mainstream NVMe PCIe 4.0 x4 Hot Swap SSD 1
2.5-inch SSDs - U.3 PCIe 4.0 NVMe - Mainstream (3-5 DWPD)
4XB7A17112 B96Z ThinkSystem U.3 Kioxia CM6-V 1.6TB Mainstream NVMe PCIe4.0 x4 Hot Swap SSD 1
4XB7A17113 B96T ThinkSystem U.3 Kioxia CM6-V 3.2TB Mainstream NVMe PCIe4.0 x4 Hot Swap SSD 1
2.5-inch SSDs - U.2 PCIe 4.0 NVMe - Entry (<3 DWPD)
4XB7A17145 BCFT ThinkSystem U.2 Intel P5500 1.92TB Entry NVMe PCIe 4.0 x4 Hot Swap SSD 1
4XB7A17146 BCFW ThinkSystem U.2 Intel P5500 3.84TB Entry NVMe PCIe 4.0 x4 Hot Swap SSD 1
Table 13. 2.5-inch hot-swap PCIe 3.0 NVMe SSDs
Part number Feature Description Maximum
supported
2.5-inch SSDs - U.2 PCIe 3.0 NVMe - Performance (10+ DWPD)
4XB7A17163 B96L ThinkSystem U.2 Intel Optane P4800X 1.5TB Performance NVMe PCIe 3.0 x4 Hot Swap SSD 60DWPD 1

Note: NVMe PCIe SSDs support surprise hot removal and hot insertion, provided the operating system supports PCIe SSD hot-swap.

Table 14. 7mm 2.5-inch hot-swap 6 Gb SATA SSDs
Part number Feature Description Maximum
supported
7mm 2.5-inch hot-swap SSDs - 6 Gb SATA - Mainstream (3-5 DWPD)
4XB7A17093 BC6E ThinkSystem 7mm 5300 240GB Mainstream SATA 6Gb Hot Swap SSD 2
4XB7A17094 BC6F ThinkSystem 7mm 5300 480GB Mainstream SATA 6Gb Hot Swap SSD 2
4XB7A38155 BAEV ThinkSystem 7mm Intel S4610 240GB Mainstream SATA 6Gb Hot Swap SSD 2
4XB7A38156 BAEW ThinkSystem 7mm Intel S4610 480GB Mainstream SATA 6Gb Hot Swap SSD 2
7mm 2.5-inch hot-swap SSDs - 6 Gb SATA - Entry (<3 DWPD)
4XB7A38181 B8JQ ThinkSystem 7mm 5300 240GB Entry SATA 6Gb SSD 2
4XB7A38182 B8JT ThinkSystem 7mm 5300 480GB Entry SATA 6Gb SSD 2
4XB7A38152 B96Q ThinkSystem 7mm Intel S4510 240GB Entry SATA 6Gb Hot Swap SSD 2
4XB7A38153 B96S ThinkSystem 7mm Intel S4510 480GB Entry SATA 6Gb Hot Swap SSD 2
Table 15. 7mm 2.5-inch hot-swap PCIe 3.0 NVMe SSDs
Part number Feature Description Maximum
supported
7mm 2.5-inch hot-swap SSDs - PCIe 3.0 NVMe - Entry (<3 DWPD)
4XB7A38216 BB63 ThinkSystem 7mm PM983 960GB Entry NVMe PCIe 3.0 x4 Hot Swap SSD 2
4XB7A69798 BJN7 ThinkSystem 7mm PM983 1.92TB Entry NVMe PCIe 3.0 x4 Hot Swap SSD 2
4XB7A69799 BJN8 ThinkSystem 7mm PM983 3.84TB Entry NVMe PCIe 3.0 x4 Hot Swap SSD 2
4XB7A69800 BJN9 ThinkSystem 7mm PM983 7.68TB Entry NVMe PCIe 3.0 x4 Hot Swap SSD 2

Note: NVMe PCIe SSDs support surprise hot removal and hot insertion, provided the operating system supports PCIe SSD hot-swap.

Table 16. M.2 SATA drives
Part number Feature Description Maximum
supported
M.2 SSDs - 6 Gb SATA - Entry (<3 DWPD)
4XB7A17071 B8HS ThinkSystem M.2 5300 240GB SATA 6Gbps Non-Hot Swap SSD 2

I/O expansion options

The SD630 V2 has one PCIe slot standard, implemented on a riser at the front of the server:

  • Slot 1: PCIe 4.0 x16 low-profile slot

Ordering information is listed in the following table.

Table 17. PCIe slot riser
Part number Feature code Description
4M17A11751 B95W ThinkSystem 1U PCIe Riser for Dense Systems

Special bid: Under special bid conditions, the SD630 V2 supports a second PCIe 4.0 x16 low-profile slot in the place of the internal drive bays. Contact your Lenovo representative for details.

Network adapters

The SD630 V2 has two dedicated network ports connected to an onboard Mellanox ConnectX-4 Lx controller.

  • 25GbE port, implemented with an SFP28 cage for optical or copper connections
  • 1GbE port, implemented with an RJ45 port for copper cabling

Locations of these ports is shown in the Components and connectors section. Either onboard port supports NC-SI for remote management. For factory orders, to specify which ports should have NC-SI enabled, use the feature codes listed in the Remote Management section. If neither is chosen, both ports will have NC-SI disabled.

For the specifications of the controller, see the Mellanox ConnectX-4 product guide:
https://lenovopress.com/lp0098-mellanox-connectx-4

The following table lists the transceivers that are supported in the 25GbE port.

Table 18. Transceivers supported in the 25GbE port
Part number Feature code Description
10Gb transceivers
46C3447 5053 SFP+ SR Transceiver
25Gb transceivers
7G17A03537 AV1B Lenovo 25GBase-SR SFP28 Transceiver

The following table lists the fiber optic cables and Active Optical Cables that are supported in the 25GbE port.

Table 19. Optical cables
Part number Feature code Description
LC-LC OM3 Fiber Optic Cables (these cables require a 10 GbE SFP+ SR or 25 GbE SFP28 SR transceiver)
00MN499 ASR5 Lenovo 0.5m LC-LC OM3 MMF Cable
00MN502 ASR6 Lenovo 1m LC-LC OM3 MMF Cable
00MN505 ASR7 Lenovo 3m LC-LC OM3 MMF Cable
00MN508 ASR8 Lenovo 5m LC-LC OM3 MMF Cable
00MN511 ASR9 Lenovo 10m LC-LC OM3 MMF Cable
00MN514 ASRA Lenovo 15m LC-LC OM3 MMF Cable
00MN517 ASRB Lenovo 25m LC-LC OM3 MMF Cable
00MN520 ASRC Lenovo 30m LC-LC OM3 MMF Cable
MTP-4xLC OM3 MMF Breakout Cables (these cables require a transceiver)
00FM412 A5UA Lenovo 1m MPO-4xLC OM3 MMF Breakout Cable
00FM413 A5UB Lenovo 3m MPO-4xLC OM3 MMF Breakout Cable
00FM414 A5UC Lenovo 5m MPO-4xLC OM3 MMF Breakout Cable
SFP+ 10Gb Active Optical Cables
00YL634 ATYX Lenovo 1M SFP+ to SFP+ Active Optical Cable
00YL637 ATYY Lenovo 3M SFP+ to SFP+ Active Optical Cable
00YL640 ATYZ Lenovo 5M SFP+ to SFP+ Active Optical Cable
00YL643 ATZ0 Lenovo 7M SFP+ to SFP+ Active Optical Cable
00YL646 ATZ1 Lenovo 15M SFP+ to SFP+ Active Optical Cable
00YL649 ATZ2 Lenovo 20M SFP+ to SFP+ Active Optical Cable
SFP28 25Gb Active Optical Cables
7Z57A03541 AV1F Lenovo 3m 25G SFP28 Active Optical Cable
7Z57A03542 AV1G Lenovo 5m 25G SFP28 Active Optical Cable
7Z57A03543 AV1H Lenovo 10m 25G SFP28 Active Optical Cable
7Z57A03544 AV1J Lenovo 15m 25G SFP28 Active Optical Cable
7Z57A03545 AV1K Lenovo 20m 25G SFP28 Active Optical Cable
QSFP28 100Gb Breakout Active Optical Cables
7Z57A03551 AV1R Lenovo 3m 100G to 4x25G Breakout Active Optical Cable
7Z57A03552 AV1S Lenovo 5m 100G to 4x25G Breakout Active Optical Cable
7Z57A03553 AV1T Lenovo 10m 100G to 4x25G Breakout Active Optical Cable
7Z57A03554 AV1U Lenovo 15m 100G to 4x25G Breakout Active Optical Cable
7Z57A03555 AV1V Lenovo 20m 100G to 4x25G Breakout Active Optical Cable
OM4 LC to LC Cables (these cables require a transceiver)
4Z57A10845 B2P9 Lenovo 0.5m LC-LC OM4 MMF Cable
4Z57A10846 B2PA Lenovo 1m LC-LC OM4 MMF Cable
4Z57A10847 B2PB Lenovo 3m LC-LC OM4 MMF Cable
4Z57A10848 B2PC Lenovo 5m LC-LC OM4 MMF Cable
4Z57A10849 B2PD Lenovo 10m LC-LC OM4 MMF Cable
4Z57A10850 B2PE Lenovo 15m LC-LC OM4 MMF Cable
4Z57A10851 B2PF Lenovo 25m LC-LC OM4 MMF Cable
4Z57A10852 B2PG Lenovo 30m LC-LC OM4 MMF Cable

The following table lists the direct-attach copper (DAC) cables that are supported in the 25GbE port.

Table 20. Copper cables
Part number Feature code Description
SFP+ 10Gb Passive DAC Cables
00D6288 A3RG 0.5m Passive DAC SFP+ Cable
90Y9427 A1PH 1m Passive DAC SFP+ Cable
00AY764 A51N 1.5m Passive DAC SFP+ Cable
00AY765 A51P 2m Passive DAC SFP+ Cable
90Y9430 A1PJ 3m Passive DAC SFP+ Cable
90Y9433 A1PK 5m Passive DAC SFP+ Cable
00D6151 A3RH 7m Passive DAC SFP+ Cable
SFP28 25Gb Passive DAC Cables
7Z57A03557 AV1W Lenovo 1m Passive 25G SFP28 DAC Cable
7Z57A03558 AV1X Lenovo 3m Passive 25G SFP28 DAC Cable
7Z57A03559 AV1Y Lenovo 5m Passive 25G SFP28 DAC Cable
QSFP28 100G-to-4x25G Breakout Cables
7Z57A03564 AV22 Lenovo 1m 100G QSFP28 to 4x25G SFP28 Breakout DAC Cable
7Z57A03565 AV23 Lenovo 3m 100G QSFP28 to 4x25G SFP28 Breakout DAC Cable
7Z57A03566 AV24 Lenovo 5m 100G QSFP28 to 4x25G SFP28 Breakout DAC Cable

Network adapters

The server also supports a network adapter installed in the PCIe slot. The following table lists the supported adapters.

Table 21. PCIe network adapters
Part
number
Feature
code
Description Maximum
supported
100Gb Ethernet / InfiniBand HDR100
4C57A14177 B4R9 ThinkSystem Mellanox ConnectX-6 HDR100/100GbE QSFP56 1-port PCIe VPI Adapter 1
200Gb Ethernet / InfiniBand HDR
4C57A15326 B4RC ThinkSystem Mellanox ConnectX-6 HDR/200GbE QSFP56 1-port PCIe 4 VPI Adapter 1
Omni-Path Architecture
00WE027 AU0B Intel OPA 100 Series Single-port PCIe 3.0 x16 HFA 1

For more information, including the transceivers and cables that each adapter supports, see the list of Lenovo Press Product Guides in the Networking adapters category:
https://lenovopress.com/servers/options/ethernet

SAS and Fibre Channel adapters for external storage

The SD630 V2 does not support SAS or Fibre Channel host bus adapters for external storage.

GPU adapters

The SD630 V2 does not support GPUs.

Flash storage adapters

The SD630 V2 does not support Flash storage adapters.

Power supplies

The ThinkSystem DA240 enclosure supports two redundant hot-swap power supplies. The power supply choices are listed in the following table. All power supplies used in server must be identical.

Tip: When configuring a server in the DCSC configurator, power consumption is calculated precisely by interfacing with Lenovo Capacity Planner. You can therefore select the appropriate power supply for your configuration. However, do consider future upgrades that may require additional power needs.

Table 37. Power supply options
Part number Feature Description Connector Quantity
supported
110V AC 220V AC 240V DC
China only
4P57A26294 B8QB ThinkSystem V2 1800W (230V) Platinum Hot-Swap Power Supply C13 2 No Yes Yes
4P57A26295 B962 ThinkSystem 2400W (230V) V2 Platinum Hot-Swap Power Supply C19 2 No Yes Yes

Power supply options do not include a line cord. For server configurations, the inclusion of a power cord is model dependent. Configure-to-order models can be configured without power cords if desired.

Power cords (C13 connectors)

Line cords and rack power cables with C13 connectors can be ordered as listed in the following table.

Table 22. Power cords
Part number Feature code Description
Rack cables
00Y3043 A4VP 1.0m, 10A/100-250V, C13 to C14 Jumper Cord
39Y7937 6201 1.5m, 10A/100-250V, C13 to C14 Jumper Cord
4L67A08369 6570 2.0m, 13A/100-250V, C13 to C14 Jumper Cord
4L67A08366 6311 2.8m, 10A/100-250V, C13 to C14 Jumper Cord
4L67A08370 6400 2.8m, 13A/100-250V, C13 to C14 Jumper Cord
39Y7932 6263 4.3m, 10A/100-250V, C13 to C14 Jumper Cord
4L67A08371 6583 4.3m, 13A/100-250V, C13 to C14 Jumper Cord
Line cords
39Y7930 6222 2.8m, 10A/250V, C13 to IRAM 2073 (Argentina) Line Cord
81Y2384 6492 4.3m, 10A/250V, C13 to IRAM 2073 (Argentina) Line Cord
39Y7924 6211 2.8m, 10A/250V, C13 to AS/NZS 3112 (Australia/NZ) Line Cord
81Y2383 6574 4.3m, 10A/250V, C13 to AS/NZS 3112 (Australia/NZ) Line Cord
69Y1988 6532 2.8m, 10A/250V, C13 to NBR 14136 (Brazil) Line Cord
81Y2387 6404 4.3m, 10A/250V, C13 to NBR 14136 (Brazil) Line Cord
39Y7928 6210 2.8m, 10A/220V, C13 to GB 2099.1 (China) Line Cord
81Y2378 6580 4.3m, 10A/250V, C13 to GB 2099.1 (China) Line Cord
39Y7918 6213 2.8m, 10A/250V, C13 to DK2-5a (Denmark) Line Cord
81Y2382 6575 4.3m, 10A/250V, C13 to DK2-5a (Denmark) Line Cord
39Y7917 6212 2.8m, 10A/250V, C13 to CEE 7/7 (Europe) Line Cord
81Y2376 6572 4.3m, 10A/250V, C13 to CEE 7/7 (Europe) Line Cord
39Y7927 6269 2.8m, 10A/250V, C13 to IS 6538 (India) Line Cord
81Y2386 6567 4.3m, 10A/250V, C13 to IS 6538 (India) Line Cord
39Y7920 6218 2.8m, 10A/250V, C13 to SI 32 (Israel) Line Cord
81Y2381 6579 4.3m, 10A/250V, C13 to SI 32 (Israel) Line Cord
39Y7921 6217 2.8m, 10A/250V, C13 to CEI 23-16 (Italy) Line Cord
81Y2380 6493 4.3m, 10A/250V, C13 to CEI 23-16 (Italy) Line Cord
4L67A08362 6495 4.3m, 12A/200V, C13 to JIS C-8303 (Japan) Line Cord
39Y7922 6214 2.8m, 10A/250V, C13 to SABS 164-1 (South Africa) Line Cord
81Y2379 6576 4.3m, 10A/250V, C13 to SANS 164-1 (South Africa) Line Cord
39Y7925 6219 2.8m, 12A/220V, C13 to KSC 8305 (S. Korea) Line Cord
81Y2385 6494 4.3m, 12A/250V, C13 to KSC 8305 (S. Korea) Line Cord
39Y7919 6216 2.8m, 10A/250V, C13 to SEV 1011-S24507 (Swiss) Line Cord
81Y2390 6578 4.3m, 10A/250V, C13 to SEV 1011-S24507 (Swiss) Line Cord
81Y2375 6317 2.8m, 10A/250V, C13 to CNS 10917 (Taiwan) Line Cord
81Y2389 6531 4.3m, 10A/250V, C13 to CNS 10917 (Taiwan) Line Cord
39Y7923 6215 2.8m, 10A/250V, C13 to BS 1363/A (UK) Line Cord
81Y2377 6577 4.3m, 10A/250V, C13 to BS 1363/A (UK) Line Cord
46M2592 A1RF 2.8m, 10A/250V, C13 to NEMA 6-15P (US) Line Cord
4L67A08361 6373 4.3m, 10A/250V, C13 to NEMA 6-15P (US) Line Cord

Power cords (C19 connectors)

Line cords and rack power cables with C19 connectors can be ordered as listed in the following table.

Table 23. Power cords (C19 connectors)
Part number Feature code Description
Rack cables
CTO only B4L0 1.0m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable
CTO only B4L1 1.5m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable
CTO only B4L2 2.0m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable
39Y7916 6252 2.5m, 16A/100-240V, C19 to IEC 320-C20 Rack Power Cable
CTO only B4L3 4.3m, 16A/100-250V, C19 to IEC 320-C20 Rack Power Cable
Line cords
40K9777 6276 4.3m, 220-240V, C19 to IRAM 2073 (Argentina) Line cord
40K9773 6284 4.3m, 220-240V, C19 to AS/NZS 3112 (Aus/NZ) Line cord
40K9775 6277 4.3m, 250V, C19 to NBR 14136 (Brazil) Line Cord
40K9774 6288 4.3m, 220-240V, C19 to GB2099.1 (China) Line cord
40K9769 6283 4.3m, 16A/230V, C19 to IEC 309-P+N+G (Den/Sws) Line Cord
40K9766 6279 4.3m, 220-240V, C19 to CEE7-VII (European) Line cord
40K9776 6285 4.3m, 220-240V, C19 to IS6538 (India) Line cord
40K9771 6282 4.3m, 220-240V, C19 to SI 32 (Israel) Line cord
40K9768 6281 4.3m, 220-240V, C19 to CEI 23-16 (Italy) Line cord
40K9770 6280 4.3m, 220-240V, C19 to SABS 164 (South Africa) Line cord
41Y9231 6289 4.3m, 15A/250V, C19 to KSC 8305 (S. Korea) Line Cord
81Y2391 6549 4.3m, 16A/230V, C19 to SEV 1011 (Sws) Line Cord
41Y9230 6287 4.3m, 16A/250V, C19 to CNS 10917-3 (Taiwan) Line Cord
40K9767 6278 4.3m, 220-240V, C19 to BS 1363/A w/13A fuse (UK) Line Cord
40K9772 6275 4.3m, 16A/208V, C19 to NEMA L6-20P (US) Line Cord
00D7197 A1NV 4.3m, 15A/250V, C19 to NEMA 6-15P (US) Line Cord

Cooling

The enclosure has 3 hot-swap 80mm dual-rotor N+1 redundant fans which are used to cool all components. The quantity required depends on the processors selected:

  • Processors with TDP ≤ 165W: 2 fans
  • Processors with TDP > 165W: 3 fans

In addition, each power supply has its own integrated fan. All fans are located at the rear of the enclosure as shown in in the Components and connectors section.

Ordering information for the enclosure fans is listed in the following table.

Table 24. Fan ordering information
Part number Feature code Description Maximum
supported
4F17A14498 BAFE ThinkSystem DA240 8080 Fan 3

Systems management

The server contains an integrated service processor, XClarity Controller (XCC), which provides advanced service-processor control, monitoring, and alerting functions. The XCC is based on the Pilot4 XE401 baseboard management controller (BMC) using a dual-core ARM Cortex A9 service processor.

Topics in this section

Local management

The SD630 V2 server supports a local console with the use of a console breakout cable. The cable connects to the port on the front of the server as shown in the following figure.

Console breakout cable
Figure 8. Console breakout cable

The cable has the following connectors:

  • VGA port
  • Serial port
  • USB 3.1 Gen 1 (5 Gb/s) port

As well as local console functions, the USB port on the breakout cable also supports the use of the XClarity Mobile app as described in the next section.

Ordering information for the cable is listed in the following table.

Table 25. Console breakout cable ordering information
Part number Feature code Description
4X97A12612 B953 ThinkSystem USB 3.0 Console Breakout Cable for Dense Systems

External Diagnostics Handset

The SD630 V2 has a port to connect an External Diagnostics Handset as shown in the following figure.

The External Diagnostics Handset allows quick access to system status, firmware, network, and health information. The LCD display on the panel and the function buttons give you access to the following information:

  • Active alerts
  • Status Dashboard
  • System VPD: machine type & mode, serial number, UUID string
  • System firmware levels: UEFI and XCC firmware
  • XCC network information: hostname, MAC address, IP address, DNS addresses
  • Environmental data: Ambient temperature, CPU temperature, AC input voltage, estimated power consumption
  • Active XCC sessions
  • System reset action

The handset has a magnet on the back of it to allow you to easily mount it on a convenient place on any rack cabinet.

SD630 V2 External Diagnostics Handset
Figure 9. SD630 V2 External Diagnostics Handset

Ordering information for the External Diagnostics Handset with is listed in the following table.

Table 26. External Diagnostics Handset ordering information
Part number Feature code Description
4TA7A64874 BEUX External Diagnostics Handset

System status with XClarity Mobile

The XClarity Mobile app includes a tethering function where you can connect your Android or iOS device to the server via USB to see the status of the server.

The steps to connect the mobile device are as follows:

  1. Enable USB Management on the server, by holding down the ID button for 3 seconds (or pressing the dedicated USB management button if one is present)
  2. Connect the mobile device via a USB cable to the server's USB port with the management symbol USB Management symbol
  3. In iOS or Android settings, enable Personal Hotspot or USB Tethering
  4. Launch the Lenovo XClarity Mobile app

Once connected you can see the following information:

  • Server status including error logs (read only, no login required)
  • Server management functions (XClarity login credentials required)

Remote management

Both the 1Gb and 25Gb embedded ports on the front of the SD630 V2 offer a connection to the XCC for remote management. This shared-NIC functionality allows the ports to be used both for operating system networking and for remote management.

Remote server management is provided through industry-standard interfaces:

  • Intelligent Platform Management Interface (IPMI) Version 2.0
  • Simple Network Management Protocol (SNMP) Version 3 (no SET commands; no SNMP v1)
  • Common Information Model (CIM-XML)
  • Representational State Transfer (REST) support
  • Redfish support (DMTF compliant)
  • Web browser - HTML 5-based browser interface (Java and ActiveX not required) using a responsive design (content optimized for device being used - laptop, tablet, phone) with NLS support

The 1Gb and 25Gb embedded ports support NC-SI. You can enable NC-SI in the factory using the feature codes listed in the following table.

Table 27. Enabling NC-SI on the embedded network ports
Feature code Description
BEXY ThinkSystem NC-SI enabled on SFP28 Port
BEXZ ThinkSystem NC-SI enabled on RJ45 Port

IPMI via the Ethernet port (IPMI over LAN) is supported, however it is disabled by default. For CTO orders you can specify whether you want to the feature enabled or disabled in the factory, using the feature codes listed in the following table.

Table 28. IPMI-over-LAN settings
Feature code Description
B7XZ Disable IPMI-over-LAN (default)
B7Y0 Enable IPMI-over-LAN

There are two XClarity Controller upgrades available for the server, Advanced and Enterprise.

XCC Advanced Upgrade adds the following functions:

  • Remotely viewing video with graphics resolutions up to 1600x1200 at 75 Hz with up to 23 bits per pixel, regardless of the system state
  • Remotely accessing the server using the keyboard and mouse from a remote client
  • International keyboard mapping support
  • Syslog alerting
  • Redirecting serial console via SSH
  • Component replacement log (Maintenance History log)
  • Access restriction (IP address blocking)
  • Lenovo SED security key management
  • Displaying graphics for real-time and historical power usage data and temperature

XCC Enterprise Upgrade enables the following additional features:

  • Boot video capture and crash video capture
  • Virtual console collaboration - Ability for up to 6 remote users to be log into the remote session simultaneously
  • Remote console Java client
  • Mapping the ISO and image files located on the local client as virtual drives for use by the server
  • Mounting the remote ISO and image files via HTTPS, SFTP, CIFS, and NFS
  • Power capping
  • System utilization data and graphic view
  • Single sign on with Lenovo XClarity Administrator
  • Update firmware from a repository
  • License for XClarity Energy Manager

For configure-to-order (CTO), you can enable the required XCC functionality by selecting the appropriate XCC feature codes listed in the following table:

  • XCC Standard - select neither feature listed in the table
  • XCC Advanced - select feature AVUT
  • XCC Enterprise - select feature AUPW
Table 29. XClarity Controller upgrades for configure-to-order
Feature code Description
AVUT ThinkSystem XClarity Controller Standard to Advanced Upgrade
AUPW ThinkSystem XClarity Controller Standard to Enterprise Upgrade

For systems with XCC Standard or XCC Advanced installed, field upgrades are available as listed in the following table.

Table 30. XClarity Controller field upgrades
Part number Description
4L47A09132 ThinkSystem XClarity Controller Standard to Advanced Upgrade
(for servers that have XCC Standard)
4L47A09133 ThinkSystem XClarity Controller Advanced to Enterprise Upgrade
(for servers that have XCC Advanced)

Remote management using the SMM

The DA240 includes a System Management Module 2 (SMM), installed in the rear of the enclosure. See Figure 3 for the location of the SMM. The SMM provides remote management of both the enclosure and the individual servers installed in the enclosure. The SMM can be accessed through a web browser interface and via Intelligent Platform Management Interface (IPMI) 2.0 commands.

The SMM provides the following functions:

  • Remote connectivity to XCC controllers in each node in the enclosure
  • Node-level reporting and control (for example, node virtual reseat/reset)
  • Enclosure power management
  • Enclosure thermal management
  • Enclosure inventory

The following figure shows the LEDs and connectors of the SMM.

System management module (SMM2)
Figure 10. System management module in the DA240 enclosure

The SMM has the following ports and LEDs:

  • 2x Gigabit Ethernet RJ45 ports for remote management access
  • USB port and activation button for service
  • SMM reset button
  • System error LED (yellow)
  • Identification (ID) LED (blue)
  • Status LED (green)
  • System power LED (green)

The USB service button and USB service port are used to gather service data in the event of an error. Pressing the service button copies First Failure Data Collection (FFDC) data to a USB key installed in the USB service port. The reset button is used to perform an SMM reset (short press) or to restore the SMM back to factory defaults (press for 4+ seconds).

The use of two RJ45 Ethernet ports enables the ability to daisy-chain the Ethernet management connections thereby reducing the number of ports you need in your management switches and reducing the overall cable density needed for systems management. With this feature you can connect the first SMM to your management network and the SMM in a second enclosure connects to the first SMM. The SMM in the third enclosure can then connect to the SMM in the second enclosure.

Up to 7 enclosures can be connected in a daisy-chain configuration, which means that with 4 servers in each node, a total of 28 servers can be managed remotely via one single Ethernet connection.

Notes:

  • If you are using IEEE 802.1D spanning tree protocol (STP) then at most 6 enclosures can be connected together
  • Do not form a loop with the network cabling. The dual-port SMM at the end of the chain should not be connected back to the switch that is connected to the top of the SMM chain.

Lenovo XClarity Provisioning Manager

Lenovo XClarity Provisioning Manager (LXPM) is a UEFI-based application embedded in ThinkSystem servers and accessible via the F1 key during system boot.

LXPM provides the following functions:

  • Graphical UEFI Setup
  • System inventory information and VPD update
  • System firmware updates (UEFI and XCC)
  • RAID setup wizard
  • OS installation wizard (including unattended OS installation)
  • Diagnostics functions

Lenovo XClarity Essentials

Lenovo offers the following XClarity Essentials software tools that can help you set up, use, and maintain the server at no additional cost:

  • Lenovo Essentials OneCLI

    OneCLI is a collection of server management tools that uses a command line interface program to manage firmware, hardware, and operating systems. It provides functions to collect full system health information (including health status), configure system settings, and update system firmware and drivers.

  • Lenovo Essentials UpdateXpress

    The UpdateXpress tool is a standalone GUI application for firmware and device driver updates that enables you to maintain your server firmware and device drivers up-to-date and help you avoid unnecessary server outages. The tool acquires and deploys individual updates and UpdateXpress System Packs (UXSPs) which are integration-tested bundles.

  • Lenovo Essentials Bootable Media Creator

    The Bootable Media Creator (BOMC) tool is used to create bootable media for offline firmware update.

For more information and downloads, visit the Lenovo XClarity Essentials web page:
http://support.lenovo.com/us/en/documents/LNVO-center

Lenovo XClarity Administrator

Lenovo XClarity Administrator is a centralized resource management solution designed to reduce complexity, speed response, and enhance the availability of Lenovo systems and solutions.

Lenovo XClarity Administrator provides agent-free hardware management for ThinkSystem servers, in addition to ThinkServer, System x, and Flex System servers. The administration dashboard is based on HTML 5 and allows fast location of resources so tasks can be run quickly.

Because Lenovo XClarity Administrator does not require any agent software to be installed on the managed endpoints, there are no CPU cycles spent on agent execution, and no memory is used, which means that up to 1GB of RAM and 1 - 2% CPU usage is saved, compared to a typical managed system where an agent is required.

Lenovo XClarity Administrator provides full management function to ThinkSystem servers, including the following:

  • Discovery
  • Inventory
  • Monitoring and alerting
  • Call home
  • Centralized user management
  • Cryptography modes, server certificates, and encapsulation
  • Configuration patterns
  • Operating system deployment
  • Firmware updates

For more information about Lenovo XClarity Administrator, including ordering part numbers, see the Lenovo XClarity Administrator Product Guide: https://lenovopress.com/tips1200-lenovo-xclarity-administrator

Lenovo XClarity Integrators

Lenovo also offers software plug-in modules, Lenovo XClarity Integrators, to manage physical infrastructure from leading external virtualization management software tools including those from Microsoft and VMware.

These integrators are offered at no charge, however if software support is required, a Lenovo XClarity Pro software subscription license should be ordered.

Lenovo XClarity Integrators offer the following additional features:

  • Ability to discover, manage, and monitor Lenovo server hardware from VMware vCenter or Microsoft System Center
  • Deployment of firmware updates and configuration patterns to Lenovo x86 rack servers and Flex System from the virtualization management tool
  • Non-disruptive server maintenance in clustered environments that reduces workload downtime by dynamically migrating workloads from affected hosts during rolling server updates or reboots
  • Greater service level uptime and assurance in clustered environments during unplanned hardware events by dynamically triggering workload migration from impacted hosts when impending hardware failures are predicted

For more information about all the available Lenovo XClarity Integrators, see the Lenovo XClarity Administrator Product Guide: https://lenovopress.com/tips1200-lenovo-xclarity-administrator

Lenovo XClarity Energy Manager

Lenovo XClarity Energy Manager is a power and temperature management solution for data centers. It is an agent-free, web-based console that enables you to monitor and manage power consumption and temperature in your data center through the management console. It enables server density and data center capacity to be increased through the use of power capping.

Lenovo XClarity Energy Manager is a licensed product. A single-node XClarity Energy Manager license is included with the XClarity Controller Enterprise (XCC Enterprise) upgrade as described in the Remote Management section. If your server does not have the XCC Enterprise upgrade, Energy Manager licenses can be ordered as shown in the following table.

Table 31. Lenovo XClarity Energy Manager
Description Part number
4L40E51621 Lenovo XClarity Energy Manager Node License (1 license needed per server)

For more information about XClarity Energy Manager, see the following resources:

Lenovo Capacity Planner

Lenovo Capacity Planner is a power consumption evaluation tool that enhances data center planning by enabling IT administrators and pre-sales professionals to understand various power characteristics of racks, servers, and other devices. Capacity Planner can dynamically calculate the power consumption, current, British Thermal Unit (BTU), and volt-ampere (VA) rating at the rack level, improving the planning efficiency for large scale deployments.

For more information, refer to the Capacity Planner web page:
http://datacentersupport.lenovo.com/us/en/solutions/lnvo-lcp

Security

The server offers the following electronic security features:

  • Administrator and power-on password
  • Trusted Platform Module (TPM) supporting TPM 2.0 (no support for TPM 1.2)
  • Optional Nationz TPM 2.0, available only in China (CTO only)

The server is NIST SP 800-147B compliant.

The following table lists the security options for the SD630 V2.

Table 32. Security features
Part number Feature code Description
CTO only* B8LE ThinkSystem Nationz Trusted Platform Module v2.0 (China customers only)

* Not available as a field upgrade. The component is CTO or on pre-configured models only.

Lenovo ThinkShield - Platform Firmware Resiliency

Lenovo’s ThinkShield Security is a transparent and comprehensive approach to security that extends to all dimensions of our data center products: from development, to supply chain, and through the entire product lifecycle.

The ThinkSystem SD630 V2 offers Platform Firmware Resiliency (PFR) hardware Root of Trust (RoT) which is NIST SP800-193 compliant. This offering further enhances key platform subsystem protections against unauthorized firmware updates and corruption, to restore firmware to an integral state, and to closely monitor firmware for possible compromise from cyber attacks.

PFR operates upon the following server components:

  • UEFI image – the low level server firmware that connects the operating system to the server hardware
  • XCC image – the management “engine” software that controls and reports on the server status separate from the server operating system
  • FPGA image – the code that runs the server’s lowest level hardware controller on the motherboard

The Lenovo Platform Root of Trust Hardware performs the following three main functions:

  • Detection – Measures the firmware and updates for authenticity
  • Recovery – Recovers a corrupted image to a known-safe image
  • Protection – Monitors the system to ensure the known-good firmware is not maliciously written

These enhanced protection capabilities are implemented using a dedicated, discrete security processor whose implementation has been rigorously validated by leading third-party security firms. Security evaluation results and design details are available for customer review – providing unprecedented transparency and assurance.

Operating system support

The server supports the following operating systems:

  • Microsoft Windows Server 2016
  • Microsoft Windows Server 2019
  • Red Hat Enterprise Linux 7.9
  • Red Hat Enterprise Linux 8.2
  • Red Hat Enterprise Linux 8.3
  • SUSE Linux Enterprise Server 12 SP5
  • SUSE Linux Enterprise Server 12 Xen SP5
  • SUSE Linux Enterprise Server 15 SP2
  • SUSE Linux Enterprise Server 15 Xen SP2
  • VMware ESXi 6.7 U3
  • VMware ESXi 7.0 U2

For a complete list of supported, certified and tested operating systems, plus additional details and links to relevant web sites, see the Operating System Interoperability Guide:
https://lenovopress.com/osig#servers=sd630-v2-7d1k

Virtualization support: The onboard SATA drives in the server can be used with virtualization hypervisors, including VMware ESXi, Linux KVM, Xen, and Microsoft Hyper-V, however support is limited to AHCI (non-RAID) mode. RSTe mode is not supported with virtualization hypervisors.

For configure-to-order configurations, the server can be preloaded with VMware ESXi installed on M.2 cards. Ordering information is listed in the following table.

Table 33. VMware ESXi preload
Part number Feature code Description
CTO only B88T VMware ESXi 6.7 U3 (factory installed)
CTO only BHSR VMware ESXi 7.0 U2 (Factory Installed)

Rack installation

The DA240 Enclosure can be installed in a 19-inch rack cabinet. Ordering information for the rail kit is listed in the following table.

Table 34. Rail installation kit
Part number Feature code Description
4M17A61253 BGWP ThinkSystem DA240 Static Rail Kit

The rail kit has the specifications listed in the following table.

Table 35. Rail kit specifications
Feature ThinkSystem DA240 Static Rail Kit
Part number 4M17A61253
Rail type Static (fixed, no slide)
Toolless installation Yes
Cable Management Arm (CMA) support No support
In-rack server maintenance No
1U PDU support Yes
0U PDU support Limited*
Rack type Lenovo and IBM 4-post, IEC standard-compliant
Mounting holes Square or round
Mounting flange thickness 2 mm - 3.3 mm (0.08 - 0.13 in.)
Supported rack range 559 mm - 914 mm (22 - 36 in.)
Rail length*** 600 mm (23.6 in.)

 * For 0U PDU support, the rack must be at least 1100 mm (43.31 in.) deep.
*** Measured when mounted on the rack, from the front surface of the front mounting flange to the rearmost point of the rail.

Supported rack cabinets are listed in the Rack cabinets section.

Physical and electrical specifications

Up to four SD630 V2 are installed in the DA240 enclosure. Each SD630 V2 has the following dimensions:

  • Width: 215 mm (8.5 inches)
  • Height: 41 mm (1.6 inches)
  • Depth: 608 mm (24 inches) (615 mm, including the internal connector at the rear of the server)

The DA240 enclosure has the following overall physical dimensions, excluding components that extend outside the standard chassis, such as EIA flanges, front security bezel (if any), and power supply handles:

  • Width: 448 mm (17.6 inches)
  • Height: 87 mm (3.4 inches)
  • Depth: 922 mm (36.3 inches)

The following table lists the detailed dimensions. See the figure below for the definition of each dimension.

Table 36. Detailed dimensions
Dimension Description
488 mm Xa = Width, to the outsides of the front EIA flanges
446 mm Xb = Width, to the rack rail mating surfaces
448 mm Xc = Width, to the outer most chassis body feature
87 mm Ya = Height, from the bottom of chassis to the top of the chassis
885 mm Za = Depth, from the rack flange mating surface to the rearmost I/O port surface
884 mm Zb = Depth, from the rack flange mating surface to the rearmost feature of the chassis body
913 mm (1800W PSU)
939 mm (2400W PSU)
Zc = Depth, from the rack flange mating surface to the rearmost feature such as power supply handle
38 mm Zd = Depth, from the forwardmost feature on front of EIA flange to the rack flange mating surface
38 mm Ze = Depth, from the front of security bezel (if applicable) or forwardmost feature to the rack flange mating surface

Rack server dimensions
Figure 11. Server dimensions

The shipping dimensions (cardboard packaging) of the SD630 V2 are as follows:

  • Width: 342 mm (13.5 inches)
  • Height: 164 mm (6.5 inches)
  • Depth: 760 mm (29.9 inches)

The shipping dimensions (cardboard packaging) of the DA240 are as follows:

  • Width: 596 mm (23.5 inches)
  • Height: 298 mm (11.7 inches)
  • Depth: 1180 mm (46.5 inches)

The SD630 V2 has the following weight:

  • Minimum: 3.9 kg (8.6 lbs)
  • Maximum: 6.4 kg (14.1 lbs)

The DA240 enclosure has the following weight:

  • Minimum (with one node): 24.3 kg (53.5 lbs)
  • Maximum (with four nodes): 44.2 kg (97.4 lbs)

The enclosure has the following electrical specifications for AC input power supplies:

  • Input voltage:
    • 200 to 240 (nominal) Vac, 50 Hz or 60 Hz
    • 180 to 300 Vdc (China only)
  • Inlet current:
    • 1800W power supply: 10 A
    • 2400W power supply: 14 A

 

Operating environment

The SD630 V2 complies with ASHRAE class A2 specifications, however depending on the ambient temperature, processor performance may be reduced:

  • When operating above 30°C there may be performance impacts at high utilization for:
    • Processors with TDP of 165 watts or lower
  • When operating above 25°C there may be performance impacts at high utilization for:
    • Processors with TDP of higher than 165 watts
    • Intel Xeon Gold 6334 8C 165W 3.5GHz Processor

Environmental information:

The ThinkSystem SD630 V2 and the DA240 enclosure are supported in the following environment:

  • Air temperature:
    • Power on:
      • ASHRAE Class A2: 10°C to 35°C (50°F to 95°F)
      • Above 900 m (2,953 ft), de-rated maximum air temperature 1°C / 300m (984 ft)
    • Power off (removed from shipping container): 5°C to 45°C (41°F to 113°F)
  • Maximum altitude: 3,050 m (10,000 ft)
  • Relative Humidity (non-condensing):
    • Power on - ASHRAE Class A2: 8% to 80%, maximum dew point 21°C (70°F)
    • Shipment/storage: 8% to 90%

Acoustical noise emissions:

The solution has the following acoustic noise emissions declaration:

  • Sound power level (LWAd):
    • Idling: Typical config: 6.1 Bel; Max config: 6.1 Bel
    • Operating: Typical config: 7.6 Bel; Max config: 8.9 Bel
  • Sound pressure level (LpAm):
    • Idling: Typical config: 45 dBA; Max config: 61 dBA
    • Operating: Typical config: 61 dBA; Max config: 74 dBA

Notes:

  • These sound levels were measured in controlled acoustical environments according to procedures specified by ISO7779 and are reported in accordance with ISO 9296.
  • The declared acoustic sound levels are based on the following specified configurations, which may change slightly depending on configuration/conditions:
    • Typical configuration: 2x 205W processors, 16x 16GB DIMMs, 1x S4510 240GB SSD, 1x Mellanox HDR200 ConnectX-6 adapter, 25Gb SFP+ LOM, TPM 2.0, 2x 2400W power supply units
    • Max configuration: 2x 250W processors, 16x 64GB DIMMs, 1x S4510 240GB SSD, 1x Mellanox HDR200 ConnectX-6 adapter, 25Gb SFP+ LOM, TPM 2.0, 2x 2400W power supply units
  • Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your solution installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.

Heat output:

Approximate heat output:

  • Minimum configuration (with one minimal configuration node): 1799.22 BTU per hour (573 watts)
  • Maximum configuration (with four maximal configuration nodes): 6672.5 BTU per hour (2125 watts)

Shock and vibration:

The server has the following vibration and shock limits:

  • Vibration:
    • Operating: 0.21 G rms at 5 Hz to 500 Hz for 15 minutes across 3 axes
    • Non-operating: 1.04 G rms at 2 Hz to 200 Hz for 15 minutes across 6 surfaces
  • Shock:
    • Operating: 15 G for 3 milliseconds in each direction (positive and negative X, Y, and Z axes)
    • Non-operating:
      • 4 kg - 11 kg: 50 G for 167 in./sec velocity change across 6 surfaces

Particulate contamination

Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might damage the system that might cause the system to malfunction or stop working altogether. The following specifications indicate the limits of particulates that the system can tolerate:

  • Reactive gases:
    • The reactivity rate of copper coupons shall be less than 200 Angstroms per month (Å/month)
    • The reactivity rate of silver coupons shall be less than 200 Å/month
  • Airborne particulates:
    • The room air should be continuously filtered with MERV 8 filters.
    • Air entering a data center should be filtered with MERV 11 or preferably MERV 13 filters.
    • The deliquescent relative humidity of the particulate contamination should be more than 60% RH
    • Data centers must be free of zinc whiskers

For additional information, see the Specifications section of the Setup Guide for the server, available from the Lenovo ThinkSystem Information Center, https://thinksystem.lenovofiles.com/help/index.jsp

Warranty and Support

The SD630 V2 and DA240 enclosure have a 3 year warranty:

  • SD630 V2 (7D1K) - 3 year warranty
  • DA240 Enclosure (7D1J) - 3 year warranty

The standard warranty terms are customer-replaceable unit (CRU) and onsite (for field-replaceable units FRUs only) with standard call center support during normal business hours and 9x5 Next Business Day Parts Delivered.

Lenovo’s additional support services provide a sophisticated, unified support structure for your data center, with an experience consistently ranked number one in customer satisfaction worldwide. Available offerings include:

  • Premier Support

    Premier Support provides a Lenovo-owned customer experience and delivers direct access to technicians skilled in hardware, software, and advanced troubleshooting, in addition to the following:

    • Direct technician-to-technician access through a dedicated phone line
    • 24x7x365 remote support
    • Single point of contact service
    • End to end case management
    • Third-party collaborative software support
    • Online case tools and live chat support
    • On-demand remote system analysis
  • Warranty Upgrade (Preconfigured Support)

    Services are available to meet the on-site response time targets that match the criticality of your systems.

    • 3, 4, or 5 years of service coverage
    • 1-year or 2-year post-warranty extensions
    • Foundation Service: 9x5 service coverage with next business day onsite response. YourDrive YourData is an optional extra (see below).
    • Essential Service: 24x7 service coverage with 4-hour onsite response or 24-hour committed repair (available only in select countries). Bundled with YourDrive YourData.
    • Advanced Service: 24x7 service coverage with 2-hour onsite response or 6-hour committed repair (available only in select countries). Bundled with YourDrive YourData.
  • Managed Services

    Lenovo Managed Services provides continuous 24x7 remote monitoring (plus 24x7 call center availability) and proactive management of your data center using state-of-the-art tools, systems, and practices by a team of highly skilled and experienced Lenovo services professionals.

    Quarterly reviews check error logs, verify firmware & OS device driver levels, and software as needed. We’ll also maintain records of latest patches, critical updates, and firmware levels, to ensure you systems are providing business value through optimized performance.

  • Technical Account Management (TAM)

    A Lenovo Technical Account Manager helps you optimize the operation of your data center based on a deep understanding of your business. You gain direct access to your Lenovo TAM, who serves as your single point of contact to expedite service requests, provide status updates, and furnish reports to track incidents over time. In addition, your TAM will help proactively make service recommendations and manage your service relationship with Lenovo to make certain your needs are met.

  • Enterprise Server Software Support

    Enterprise Software Support is an additional support service providing customers with software support on Microsoft, Red Hat, SUSE, and VMware applications and systems. Around the clock availability for critical problems plus unlimited calls and incidents helps customers address challenges fast, without incremental costs. Support staff can answer troubleshooting and diagnostic questions, address product comparability and interoperability issues, isolate causes of problems, report defects to software vendors, and more.

  • YourDrive YourData

    Lenovo’s YourDrive YourData is a multi-drive retention offering that ensures your data is always under your control, regardless of the number of drives that are installed in your Lenovo server. In the unlikely event of a drive failure, you retain possession of your drive while Lenovo replaces the failed drive part. Your data stays safely on your premises, in your hands. The YourDrive YourData service can be purchased in convenient bundles and is optional with Foundation Service. It is bundled with Essential Service and Advanced Service.

  • Health Check

    Having a trusted partner who can perform regular and detailed health checks is central to maintaining efficiency and ensuring that your systems and business are always running at their best. Health Check supports Lenovo-branded server, storage, and networking devices, as well as select Lenovo-supported products from other vendors that are sold by Lenovo or a Lenovo-Authorized Reseller.

Examples of region-specific warranty terms are second or longer business day parts delivery or parts-only base warranty.

If warranty terms and conditions include onsite labor for repair or replacement of parts, Lenovo will dispatch a service technician to the customer site to perform the replacement. Onsite labor under base warranty is limited to labor for replacement of parts that have been determined to be field-replaceable units (FRUs). Parts that are determined to be customer-replaceable units (CRUs) do not include onsite labor under base warranty.

If warranty terms include parts-only base warranty, Lenovo is responsible for delivering only replacement parts that are under base warranty (including FRUs) that will be sent to a requested location for self-service. Parts-only service does not include a service technician being dispatched onsite. Parts must be changed at customer’s own cost and labor and defective parts must be returned following the instructions supplied with the spare parts.

Lenovo Service offerings are region-specific. Not all preconfigured support and upgrade options are available in every region. For information about Lenovo service upgrade offerings that are available in your region, refer to the following resources:

For service definitions, region-specific details, and service limitations, please refer to the following documents:

Services

Lenovo Services is a dedicated partner to your success. Our goal is to reduce your capital outlays, mitigate your IT risks, and accelerate your time to productivity.

Note: Some service options may not be available in all countries. For more information, go to https://www.lenovo.com/systems/services. For information about Lenovo service upgrade offerings that are available in your region, contact your local Lenovo sales representative or business partner.

Here’s a more in-depth look at what we can do for you:

  • Asset Recovery Services

    Asset Recovery Services (ARS) helps customers recover the maximum value from their end-of-life equipment in a cost-effective and secure way. On top of simplifying the transition from old to new equipment, ARS mitigates environmental and data security risks associated with data center equipment disposal. Lenovo ARS is a cash-back solution for equipment based on its remaining market value, yielding maximum value from aging assets and lowering total cost of ownership for your customers. For more information, see the ARS page, https://lenovopress.com/lp1266-reduce-e-waste-and-grow-your-bottom-line-with-lenovo-ars.

  • Assessment Services

    An Assessment helps solve your IT challenges through an onsite, multi-day session with a Lenovo technology expert. We perform a tools-based assessment which provides a comprehensive and thorough review of a company's environment and technology systems. In addition to the technology based functional requirements, the consultant also discusses and records the non-functional business requirements, challenges, and constraints. Assessments help organizations like yours, no matter how large or small, get a better return on your IT investment and overcome challenges in the ever-changing technology landscape.

  • Design Services

    Professional Services consultants perform infrastructure design and implementation planning to support your strategy. The high-level architectures provided by the assessment service are turned into low level designs and wiring diagrams, which are reviewed and approved prior to implementation. The implementation plan will demonstrate an outcome-based proposal to provide business capabilities through infrastructure with a risk-mitigated project plan.

  • Basic Hardware Installation

    Lenovo experts can seamlessly manage the physical installation of your server, storage, or networking hardware. Working at a time convenient for you (business hours or off shift), the technician will unpack and inspect the systems on your site, install options, mount in a rack cabinet, connect to power and network, check and update firmware to the latest levels, verify operation, and dispose of the packaging, allowing your team to focus on other priorities.

  • Deployment Services

    When investing in new IT infrastructures, you need to ensure your business will see quick time to value with little to no disruption. Lenovo deployments are designed by development and engineering teams who know our Products & Solutions better than anyone else, and our technicians own the process from delivery to completion. Lenovo will conduct remote preparation and planning, configure & integrate systems, validate systems, verify and update appliance firmware, train on administrative tasks, and provide post-deployment documentation. Customer’s IT teams leverage our skills to enable IT staff to transform with higher level roles and tasks.

  • Integration, Migration, and Expansion Services

    Move existing physical & virtual workloads easily, or determine technical requirements to support increased workloads while maximizing performance. Includes tuning, validation, and documenting ongoing run processes. Leverage migration assessment planning documents to perform necessary migrations.

Regulatory compliance

The ThinkSystem SD630 V2 server conforms to the following international standards:

  • ANSI/UL 62368-1
  • IEC 62368-1(CB Certificate and CB Test Report)
  • FCC - Verified to comply with Part 15 of the FCC Rules, Class A
  • Canada ICES-003, issue 7, Class A
  • CSA C22.2 No. 62368-1
  • CISPR 32, Class A, CISPR 35
  • Japan VCCI, Class A
  • Taiwan BSMI CNS13438, Class A; Section 5 of CNS15663
  • CE, UKCA Mark (EN55032 Class A, EN62368-1, EN55024, EN55035, EN61000-3-2, EN61000-3-3, (EU) 2019/424, and EN50581)
  • Korea KN32, Class A, KN35
  • Russia, Belorussia and Kazakhstan, TP EAC 037/2016 (for RoHS)
  • Australia/New Zealand AS/NZS CISPR 32, Class A; AS/NZS 62368.1
  • China CELP certificate, HJ 2507-2011
  • UL Green Guard, UL2819
  • Energy Star 3.0
  • EPEAT (NSF/ ANSI 426) Bronze
  • Japanese Energy-Saving Act

The DA240 enclosure conforms to the following international standards:

  • ANSI/UL 62368-1
  • Canada ICES-003, issue 7, Class A
  • CSA C22.2 No. 62368-1
  • FCC - Verified to comply with Part 15 of the FCC Rules, Class A
  • Argentina IEC 60950-1
  • Japan VCCI, Class A
  • IEC 62368-1 (CB Certificate and CB Test Report)
  • China CCC GB4943.1, GB9254, Class A, and GB17625.1
  • Australia/New Zealand AS/NZS CISPR 32, Class A; AS/NZS 62368.1
  • Korea KN32, Class A, KN35
  • Russia, Belorussia and Kazakhstan, EAC: TP TC 004/2011(for Safety); TP TC 020/2011(for EMC); TP EAC 037/2016 (for RoHS)
  • Mexico NOM-019
  • CE, UKCA Mark (EN55032 Class A, EN55024, EN55035, EN61000-3-2, EN61000-3-3, and EN50581)
  • CISPR 32, Class A, CISPR 35
  • TUV-GS (EN62368-1, and EK1-ITB2000)
  • UL Green Guard, UL2819
  • China CELP certificate, HJ 2507-2011

Power distribution units

The following table lists the power distribution units (PDUs) that are offered by Lenovo.

Table 37. Power distribution units
Part number Description
0U Basic PDUs
00YJ776 0U 36 C13/6 C19 24A/200-240V 1 Phase PDU with NEMA L6-30P line cord
00YJ777 0U 36 C13/6 C19 32A/200-240V 1 Phase PDU with IEC60309 332P6 line cord
00YJ778 0U 21 C13/12 C19 32A/200-240V/346-415V 3 Phase PDU with IEC60309 532P6 line cord
00YJ779 0U 21 C13/12 C19 48A/200-240V 3 Phase PDU with IEC60309 460P9 line cord
Switched and Monitored PDUs
00YJ780 0U 20 C13/4 C19 Switched and Monitored 32A/200-240V/1Ph PDU w/ IEC60309 332P6 line cord
00YJ781 0U 20 C13/4 C19 Switched and Monitored 24A/200-240V/1Ph PDU w/ NEMA L6-30P line cord
00YJ782 0U 18 C13/6 C19 Switched / Monitored 32A/200-240V/346-415V/3Ph PDU w/ IEC60309 532P6 cord
00YJ783 0U 12 C13/12 C19 Switched and Monitored 48A/200-240V/3Ph PDU w/ IEC60309 460P9 line cord
46M4002 1U 9 C19/3 C13 Switched and Monitored DPI PDU (without line cord)
46M4003 1U 9 C19/3 C13 Switched and Monitored 60A 3 Phase PDU with IEC 309 3P+Gnd line cord
46M4004 1U 12 C13 Switched and Monitored DPI PDU (without line cord)
46M4005 1U 12 C13 Switched and Monitored 60A 3 Phase PDU with IEC 309 3P+Gnd line cord
Ultra Density Enterprise PDUs (9x IEC 320 C13 + 3x IEC 320 C19 outlets)
71762NX Ultra Density Enterprise C19/C13 PDU Module (without line cord)
71763NU Ultra Density Enterprise C19/C13 PDU 60A/208V/3ph with IEC 309 3P+Gnd line cord
C13 Enterprise PDUs (12x IEC 320 C13 outlets)
39M2816 DPI C13 Enterprise PDU+ (without line cord)
39Y8941 DPI Single Phase C13 Enterprise PDU (without line cord)
C19 Enterprise PDUs (6x IEC 320 C19 outlets)
39Y8948 DPI Single Phase C19 Enterprise PDU (without line cord)
39Y8923 DPI 60A 3 Phase C19 Enterprise PDU with IEC 309 3P+G (208 V) fixed line cord
Front-end PDUs (3x IEC 320 C19 outlets)
39Y8939 DPI 30amp/250V Front-end PDU with NEMA L6-30P line cord
39Y8934 DPI 32amp/250V Front-end PDU with IEC 309 2P+Gnd line cord
39Y8940 DPI 60amp/250V Front-end PDU with IEC 309 2P+Gnd line cord
39Y8935 DPI 63amp/250V Front-end PDU with IEC 309 2P+Gnd line cord
Line cords for PDUs that ship without a line cord
40K9611 DPI 32a Line Cord (IEC 309 3P+N+G)
40K9612 DPI 32a Line Cord (IEC 309 P+N+G)
40K9613 DPI 63a Cord (IEC 309 P+N+G)
40K9614 DPI 30a Line Cord (NEMA L6-30P)
40K9615 DPI 60a Cord (IEC 309 2P+G)
40K9617 DPI Australian/NZ 3112 Line Cord
40K9618 DPI  Korean 8305 Line Cord

For more information, see the Lenovo Press documents in the PDU category:
https://lenovopress.com/servers/options/pdu

Rack cabinets

The following table lists the supported rack cabinets.

Table 38. Rack cabinets
Part number Description
93072RX 25U Standard Rack
93072PX 25U Static S2 Standard Rack
93634PX 42U 1100mm Dynamic Rack
93634EX 42U 1100mm Dynamic Expansion Rack
93604PX 42U 1200mm Deep Dynamic Rack
93614PX 42U 1200mm Deep Static Rack
93084EX 42U Enterprise Expansion Rack
93084PX 42U Enterprise Rack
93074RX 42U Standard Rack
Withdrawn rack cabinets
201886X 11U Office Enablement Kit
93604EX 42U 1200mm Deep Dynamic Expansion Rack
93614EX 42U 1200mm Deep Static Expansion Rack
93074XX 42U Standard Rack Extension
93624PX 47U 1200mm Deep Static Rack
93624EX 47U 1200mm Deep Static Expansion Rack
93634BX PureFlex System 42U Expansion Rack
93634DX PureFlex System 42U Expansion Rack
93634AX PureFlex System 42U Rack
93634CX PureFlex System 42U Rack

For specifications about these racks, see the Lenovo Rack Cabinet Reference, available from:
https://lenovopress.com/lp1287-lenovo-rack-cabinet-reference

For more information, see the list of Product Guides in the Rack cabinets category:
https://lenovopress.com/servers/options/racks

KVM switches and consoles

The following table lists the supported KVM consoles, keyboards, and KVM switches.

Table 39. Console keyboards
Part number Description
Consoles
17238BX 1U 18.5" Standard Console (without keyboard)
Console keyboards
7ZB7A05469 ThinkSystem Keyboard w/ Int.Pointing Device USB - Arabic 253 RoHS v2
7ZB7A05468 ThinkSystem Keyboard w/ Int. Pointing Device USB - Belg/UK 120 RoHS v2
7ZB7A05206 ThinkSystem Keyboard w/ Int. Pointing Device USB - Czech 489 RoHS v2
7ZB7A05207 ThinkSystem Keyboard w/ Int. Pointing Device USB - Danish 159 RoHS v2
7ZB7A05208 ThinkSystem Keyboard w/ Int. Pointing Device USB - Dutch 143 RoHS v2
7ZB7A05210 ThinkSystem Keyboard w/ Int. Pointing Device USB - Fr/Canada 445 RoHS v2
7ZB7A05209 ThinkSystem Keyboard w/ Int. Pointing Device USB - French 189 RoHS v2
7ZB7A05211 ThinkSystem Keyboard w/ Int. Pointing Device USB - German 129 RoHS v2
7ZB7A05212 ThinkSystem Keyboard w/ Int. Pointing Device USB - Greek 219 RoHS v2
7ZB7A05213 ThinkSystem Keyboard w/ Int. Pointing Device USB - Hebrew 212 RoHS v2
7ZB7A05214 ThinkSystem Keyboard w/ Int. Pointing Device USB - Hungarian 208 RoHS v2
7ZB7A05215 ThinkSystem Keyboard w/ Int. Pointing Device USB - Italian 141 RoHS v2
7ZB7A05216 ThinkSystem Keyboard w/ Int. Pointing Device USB - Japanese 194 RoHS v2
7ZB7A05217 ThinkSystem Keyboard w/ Int. Pointing Device USB - Korean 413 RoHS v2
7ZB7A05218 ThinkSystem Keyboard w/ Int. Pointing Device USB - LA Span 171 RoHS v2
7ZB7A05219 ThinkSystem Keyboard w/ Int. Pointing Device USB - Norwegian 155 RoHS v2
7ZB7A05220 ThinkSystem Keyboard w/ Int. Pointing Device USB - Polish 214 RoHS v2
7ZB7A05221 ThinkSystem Keyboard w/ Int. Pointing Device USB - Portugese 163 RoHS v2
7ZB7A05222 ThinkSystem Keyboard w/ Int. Pointing Device USB - Russian 441 RoHS v2
7ZB7A05223 ThinkSystem Keyboard w/ Int. Pointing Device USB - Slovak 245 RoHS v2
7ZB7A05231 ThinkSystem Keyboard w/ Int. Pointing Device USB - Slovenian 234 RoHS v2
7ZB7A05224 ThinkSystem Keyboard w/ Int. Pointing Device USB - Spanish 172 RoHS v2
7ZB7A05225 ThinkSystem Keyboard w/ Int. Pointing Device USB - Swed/Finn 153 RoHS v2
7ZB7A05226 ThinkSystem Keyboard w/ Int. Pointing Device USB - Swiss F/G 150 RoHS v2
7ZB7A05227 ThinkSystem Keyboard w/ Int. Pointing Device USB - Thai 191 RoHS v2
7ZB7A05467 ThinkSystem Keyboard with Int. Pointing Device USB - Trad Chinese/US 467 RoHS v2
7ZB7A05228 ThinkSystem Keyboard w/ Int. Pointing Device USB - Turkish 179 RoHS v2
7ZB7A05229 ThinkSystem Keyboard w/ Int. Pointing Device USB - UK Eng 166 RoHS v2
7ZB7A05470 ThinkSystem Keyboard w/ Int. Pointing Device USB - US Eng 103P RoHS v2
7ZB7A05230 ThinkSystem Keyboard w/ Int. Pointing Device USB - US Euro 103P RoHS v2
ThinkSystem Digital and Analog KVM Console switches and cables
1754D1T ThinkSystem Digital 2x1x16 KVM Switch (DVI video output port)
1754A1T ThinkSystem Analog 1x8 KVM Switch (DVI video output port)
4X97A11108 ThinkSystem VGA to DVI Conversion Cable
4X97A11109 ThinkSystem Single-USB Conversion Cable for Digital KVM
4X97A11107 ThinkSystem Dual-USB Conversion Cable for Digital KVM
4X97A11106 ThinkSystem USB Conversion Cable for Analog KVM
GCM and LCM Console switches and cables
1754D2X Global 4x2x32 Console Manager (GCM32)
1754D1X Global 2x2x16 Console Manager (GCM16)
1754A2X Local 2x16 Console Manager (LCM16)
1754A1X Local 1x8 Console Manager (LCM8)
43V6147 Single Cable USB Conversion Option (UCO)
39M2895 USB Conversion Option Pack
46M5383 Virtual Media Conversion Option Gen2 (VCO2)
46M5382 Serial Conversion Option (SCO)

For more information, see the list of Product Guides in the KVM Switches and Consoles category:
http://lenovopress.com/servers/options/kvm

Lenovo Financial Services

Lenovo Financial Services reinforces Lenovo’s commitment to deliver pioneering products and services that are recognized for their quality, excellence, and trustworthiness. Lenovo Financial Services offers financing solutions and services that complement your technology solution anywhere in the world.

We are dedicated to delivering a positive finance experience for customers like you who want to maximize your purchase power by obtaining the technology you need today, protect against technology obsolescence, and preserve your capital for other uses.

We work with businesses, non-profit organizations, governments and educational institutions to finance their entire technology solution. We focus on making it easy to do business with us. Our highly experienced team of finance professionals operates in a work culture that emphasizes the importance of providing outstanding customer service. Our systems, processes and flexible policies support our goal of providing customers with a positive experience.

We finance your entire solution. Unlike others, we allow you to bundle everything you need from hardware and software to service contracts, installation costs, training fees, and sales tax. If you decide weeks or months later to add to your solution, we can consolidate everything into a single invoice.

Our Premier Client services provide large accounts with special handling services to ensure these complex transactions are serviced properly. As a premier client, you have a dedicated finance specialist who manages your account through its life, from first invoice through asset return or purchase. This specialist develops an in-depth understanding of your invoice and payment requirements. For you, this dedication provides a high-quality, easy, and positive financing experience.

For your region specific offers please ask your Lenovo sales representative or your technology provider about the use of Lenovo Financial Services. For more information, see the following Lenovo website:

https://www.lenovo.com/us/en/landingpage/lenovo-financial-services/

Related product families

Product families related to this document are the following:

Trademarks

Lenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web at https://www.lenovo.com/us/en/legal/copytrade/.

The following terms are trademarks of Lenovo in the United States, other countries, or both:
Lenovo®
Bootable Media Creator
Flex System
Lenovo Neptune
Lenovo Services
ServerProven®
System x®
ThinkServer®
ThinkSystem
TruDDR4
UpdateXpress System Packs
XClarity®

The following terms are trademarks of other companies:

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Linux® is the trademark of Linus Torvalds in the U.S. and other countries.

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Other company, product, or service names may be trademarks or service marks of others.