Lenovo ThinkSystem SR860 V2 ServerProduct Guide

Author
Published
18 Jun 2020
Form Number
LP1302
PDF size
15 pages, 1.9 MB

Abstract

The Lenovo ThinkSystem SR860 V2 is a 4-socket server that features a 4U rack design with support for high-performance GPUs. The server offers technology advances, including third-generation Intel Xeon Scalable processors with support for Intel Optane Persistent Memory 200 Series.

This product guide provides essential pre-sales information to understand the ThinkSystem SR860 V2 server, its key features and specifications, components and options, and configuration guidelines. This guide is intended for technical specialists, sales specialists, sales engineers, IT architects, and other IT professionals who want to learn more about the SR860 V2 and consider its use in IT solutions.

Preview Product Guide: This product guide is a preview version and includes only a subset of a normal server product guide. The SR860 V2 will be orderable in the DCSC configurator in October 2020 and generally available starting in November 2020. Contact your sales rep for more information.

Introduction

The Lenovo ThinkSystem SR860 V2 is a 4-socket server that features a 4U rack design with support for high-performance GPUs. The server offers technology advances, including third-generation Intel Xeon Scalable processors with Intel Optane Persistent Memory 200 Series, and scale-up capacity with up to 12TB of system memory, up to 14x PCIe slots, and up to 48x 2.5-inch drive bays.

Suggested uses: Mission critical workloads such as SAP HANA in-memory computing, transactional databases, deep learning, analytics, big data, and virtual machine density.

Lenovo ThinkSystem SR860 V2
Figure 1. Lenovo ThinkSystem SR860 V2

Did you know?

The Lenovo ThinkSystem SR860 V2 provides the advanced capabilities of four of the new third-generation Intel Xeon Scalable processors plus support for four double-wide GPUs such as the NVIDIA Tesla V100S GPU. This combination gives you significant processing power in one server.

The SR860 V2 has space for 48x 2.5-inch drive bays, 24 of which can be configured as AnyBay drives - supporting SAS, SATA or NVMe drives. NVMe drives are high-speed, low-latency storage, ideal for storage tiering.

Key features

The flexible ThinkSystem SR860 V2 server supports third-generation Intel Xeon Scalable Gold or Platinum processors and can scale from two to four processors. Built for standard workloads like general business applications and server consolidation, it can also accommodate high-growth areas such as databases and virtualization. The ThinkSystem SR860 V2’s agile design permits rapid upgrades for processors and memory, and its large, flexible storage capacity helps to keep pace with data growth.

With the capability to support up to 48 DIMMs, four sockets, up to 48 drives for internal storage, support for up to eight high-performance NVIDIA Tesla T4 GPUs or four NVIDIA V100S GPUs, and a dedicated OCP 3.0 slot for 1, 10 or 25 GbE networking, the SR860 V2 provides unmatched features and capabilities in a 4U rack-mount design.

Scalability and performance

The SR860 V2 offers numerous features to boost performance, improve scalability and reduce costs: 

  • Supports third-generation Intel Xeon Processor Scalable processors
  • Supports Gold and Platinum level processors in the Intel Xeon Processor Scalable Family. Processors supported have up to 28 cores, core speeds of up to 3.1 GHz, and TDP ratings of up to 250W.
  • The SR860 V2's processor expansion tray design enables you to start with two processors and 24 DIMM sockets and upgrade to four processors and 48 DIMM sockets when you need it, helping lower initial costs and manage growth.
  • Up to four processors, 112 cores, and 224 threads maximize the concurrent execution of multithreaded applications.
  • Enhanced inter-processor communications with six UPI connections between adjacent processors ensures increased CPU I/O throughput.
  • Supports the new bfloat16 instruction set for Enhanced Deep Learning Boost
  • Intelligent and adaptive system performance with Intel Turbo Boost Technology 2.0 allows processor cores to run at maximum speeds during peak workloads by temporarily going beyond processor TDP.
  • Intel Hyper-Threading Technology boosts performance for multithreaded applications by enabling simultaneous multithreading within each processor core, up to two threads per core.
  • Intel Virtualization Technology integrates hardware-level virtualization hooks that allow operating system vendors to better use the hardware for virtualization workloads.
  • Intel Speed Select Technology supported on some processor models, enables increased core Turbo Boost frequency on specific individual cores to maximize application performance.
  • Enhanced Intel Deep Learning Boost provides built-in acceleration with the Vector Neural Network Instruction set (VNNI) and new bloat16 instructions. These are designed to deliver significant, more efficient Deep Learning (Inference) acceleration for high-performance Artificial Intelligence (AI) workloads.
  • Intel Advanced Vector Extensions 512 (AVX-512) enable acceleration of enterprise-class workloads, including databases and enterprise resource planning (ERP).
  • Support for up to 48 TruDDR4 memory DIMMs operating at up to 3200 MHz means you have the fastest available memory subsystem and memory capacity of up to 12 TB with 48x 256 GB 3DS RDIMMs.
  • Supports configurations of 2 DIMMs per channel to operate at the 3200 MHz rated speed of the memory DIMMs.
  • Supports the new Intel Optane Persistent Memory 200 Series for advanced in-memory database applications, dense-virtualization; up to 24 PMem Modules can be installed in conjunction with regular system memory. PMem modules are up to 512 GB each, for a total of up to 12 TB of Persistent Memory (3 TB per processor).
  • The use of solid-state drives (SSDs) instead of, or along with, traditional spinning drives (HDDs), can improve I/O performance. An SSD can support up to 100 times more I/O operations per second (IOPS) than a typical HDD.
  • Up to 48x 2.5-inch drive bays -- supporting combinations of SAS or SATA HDDs, SAS or SATA SSDs, and NVMe PCIe SSDs -- provide a flexible and scalable all-in-one platform to meet your increasing demands. Up to 24x NVMe drives are supported, maximizing drive I/O performance in terms of throughput, bandwidth, and latency.
  • The server has a dedicated industry-standard OCP 3.0 small form factor (SFF) slot, with a PCIe 3.0 x16 interface, supporting a variety of Ethernet network adapters. Simple-swap mechanism with thumbscrews and pull-tab enables tool-less installation and removal of the adapter. Supports shared BMC network sideband connectivity to enable out-of-band systems management.
  • Up to 14 PCIe 3.0 slots in addition to the OCP 3.0 Ethernet slot to maximize I/O capabilities.
  • New high-speed RAID controllers from Broadcom provide 12 Gb SAS connectivity to the drive backplanes. A variety of RAID adapters are available, with cache up to 8 GB and support for 32 drives on a single controller. The RAID 940-16i 8GB Flash adapter supports RAID volumes with NVMe, SAS or SATA drives.
  • Support for four high-performance double-wide GPUs such as the NVIDIA Tesla V100S, or eight single-wide GPUs such as the NVIDIA T4 GPU. GPUs adds additional processing power to the server.
  • Supports up to two externally accessible 7mm hot-swap drives with RAID functionality, in addition to the 48 front drive bays. These 7mm drives are ideal for operating system boot functions.
  • As an alternative to the 7mm drives, the server supports the Lenovo patented-design M.2 adapter for convenient operating system boot functions. Available M.2 adapters support either one M.2 drive or two M.2 drives in a RAID 1 configuration for boot drive performance and reliability.
  • Integrated SATA controller with Software RAID (Intel RSTe) support for up to 8x drives with basic RAID functionality with no additional adapter needed.
  • Supports Intel VROC (Virtual RAID on CPU) which enables basic RAID functionality on the onboard NVMe ports of the server, with no additional adapter needed. This feature enables RAID on NVMe drives without the need for a separate RAID adapter.

Availability and serviceability

The SR860 V2 provides many features to simplify serviceability and increase system uptime:

  • The server offers Single Device Data Correction (SDDC, also known as Chipkill), Adaptive Double-Device Data Correction (ADDDC, also known as Redundant Bit Steering or RBS), memory mirroring, and memory rank sparing for redundancy in the event of a non-correctable memory failure.
  • The server offers hot-swap drives, supporting RAID redundancy for data protection and greater system uptime.
  • Available M.2 RAID Boot Adapter supports RAID-1 which can enable two SATA M.2 drives to be configured as a redundant pair.
  • Available pair of 7mm hot-swap drives support RAID-1 which can enable two SATA or two NVMe drive to be configured as a redundant pair.
  • The server has up to four hot-swap redundant power supplies and eight N+1 redundant fans to provide availability for business-critical applications.
  • The power-source-independent light path diagnostics uses LEDs to lead the technician to failed (or failing) components, which simplifies servicing, speeds up problem resolution, and helps improve system availability.
  • An integrated diagnostics panel with LCD display (optional in China, standard in other markets) provides more detailed diagnostics by displaying all error messages and VPD data needed for a service call, thereby aiding with problem resolution and system uptime.
  • Proactive Platform Alerts (including PFA and SMART alerts): Processors, voltage regulators, memory, internal storage (SAS/SATA HDDs and SSDs, NVMe SSDs, M.2 storage, flash storage adapters), fans, power supplies, RAID controllers, server ambient and subcomponent temperatures. Alerts can be surfaced through the XClarity Controller to managers such as Lenovo XClarity Administrator, VMware vCenter, and Microsoft System Center. These proactive alerts let you take appropriate actions in advance of possible failure, thereby increasing server uptime and application availability.
  • Solid-state drives (SSDs) offer more reliability than traditional mechanical HDDs for greater uptime.
  • The built-in XClarity Controller continuously monitors system parameters, triggers alerts, and performs recovery actions in case of failures, to minimize downtime.
  • Built-in diagnostics in UEFI, using Lenovo XClarity Provisioning Manager, speed up troubleshooting tasks to reduce service time.
  • Lenovo XClarity Provisioning Manager collects and saves service data to USB key drive or remote CIFS share folder, for troubleshooting and to reduce service time.
  • Auto restart in the event of a momentary loss of AC power (based on the power policy setting in the XClarity Controller service processor)
  • Support for the XClarity Administrator Mobile app running on a supported smartphone or tablet and connected to the server through the front USB 2.0 port, enables additional local systems management functions.
  • Three-year or one-year customer-replaceable unit and onsite limited warranty, 9 x 5 next business day. Optional service upgrades are available.

Manageability and security

Powerful systems management features simplify local and remote management of the SR860 V2:

  • Lenovo XClarity Controller (XCC) monitors server availability and performs remote management. XCC Advanced is standard, which enables remote KVM. Optional XCC Enterprise enables the mounting of remote media files (ISO and IMG image files), boot capture, and power capping.
  • Lenovo XClarity Administrator offers comprehensive hardware management tools that help to increase uptime, reduce costs and improve productivity through advanced server management capabilities.
  • UEFI-based Lenovo XClarity Provisioning Manager, accessible from F1 during boot, provides system inventory information, graphical UEFI Setup, platform update function, RAID Setup wizard, operating system installation function, and diagnostic functions.
  • Support for Lenovo XClarity Energy Manager, which captures real-time power and temperature data from the server and provides automated controls to lower energy costs.
  • Integrated Trusted Platform Module (TPM) 2.0 support enables advanced cryptographic methods, such as digital signatures and remote attestation.
  • Supports Secure Boot to ensure only a digitally signed operating system can be used. Supported with HDDs and SSDs, as well as 7mm and M.2 drives.
  • Industry-standard Advanced Encryption Standard (AES) NI support for faster, stronger encryption.
  • Intel Execute Disable Bit functionality can prevent certain classes of malicious buffer overflow attacks when combined with a supported operating system.
  • Intel Trusted Execution Technology provides enhanced security through hardware-based resistance to malicious software attacks, allowing an application to run in its own isolated space, protected from all other software running on a system.

Energy efficiency

The SR860 V2 offers the following energy-efficiency features to save energy, reduce operational costs, and increase energy availability:

  • Energy-efficient planar components help lower operational costs.
  • High-efficiency power supplies with 80 PLUS Platinum and Titanium certifications
  • Intel Intelligent Power Capability turns individual processor elements on and off as needed to reduce power draw.
  • Low-voltage 1.2 V DDR4 memory offers energy savings compared to 1.35 V and 1.5 V DDR3 DIMMs.
  • Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch HDDs.
  • The server uses hexagonal ventilation holes, which can be grouped more densely than round holes, providing more efficient airflow through the system and thus keeping your system cooler.
  • Optional Lenovo XClarity Energy Manager provides advanced data center power notification, analysis, and policy-based management to help achieve lower heat output and reduced cooling needs.

Components and connectors

The following figure shows the front of the server.

ThinkSystem SR860 V2 front view
Figure 2. Front view of the ThinkSystem SR860 V2

The following figure shows the rear of the server.

ThinkSystem SR860 V2 rear view
Figure 3. Rear view of the ThinkSystem SR860 V2

The following figure shows the locations of key components inside the server with the GPU trays and the processor and memory expansion tray removed.

Internal view (GPU trays and the processor and memory expansion tray removed)
Figure 4. Internal view (GPU trays and the processor and memory expansion tray removed)

The following figure shows the inside the server with processor and memory expansion tray installed.

Internal view (processor and memory expansion tray installed)
Figure 5. Internal view (processor and memory expansion tray installed)

The upper 2U of the server is where the GPU adapters are installed. The following figure shows the inside the server with GPU tray and upper riser slots installed.

Internal view (GPU tray and riser slots installed)
Figure 6. Internal view (GPU tray and riser slots installed)

System architecture

The following figure shows the architectural block diagram of the SR860 V2, showing the major components and their connections.

SR860 V2 system architectural block diagram
Figure 7. SR860 V2 system architectural block diagram

Standard specifications

The following table lists the standard specifications.

Table 1. Standard specifications
Components Specification
Machine types 7Z59 - 1-year warranty
7Z60 - 3-year warranty
7D42 - SAP HANA configurations with 3-year warranty
Form factor 4U rack.
Processor Two or four third-generation Intel Xeon Scalable processors, either Gold or Platinum level processors (formerly codename "Cooper Lake" or CPX6). Supports processors up to 28 cores, core speeds up to 3.1 GHz, and TDP ratings up to 250W. Two processor sockets on the system board and two processors on the Processor and Memory Expansion Tray. Six Intel Ultra Path Interconnect (UPI) links at 10.4 GT/s each. Four processors are connected in a mesh topology.
Chipset Intel C620A "Lewisburg" chipset, part of the platform codenamed "Cedar Island" (CDS)
Memory Up to 48 DIMM slots (12 DIMMs per processor). Each processor has 6 memory channels, with 2 DIMMs per channel. Lenovo TruDDR4 RDIMMs and 3DS RDIMMs are supported. 24 DIMM sockets on the system board, and an additional 24 DIMM sockets on the processor and memory expansion tray. DIMM slots are shared between standard system memory and persistent memory. DIMMs operate at up to 3200 MHz at 2 DPC.
Persistent memory Supports up to 24x Intel Optane Persistent Memory 200 Series modules installed in the DIMM slots. Persistent memory is installed in combination with system memory DIMMs. Supports App Direct mode to enhance the performance of applications such as SAP HANA.
Memory maximums
  • With system memory DIMMs: Up to 12TB with 48x 256GB 3DS RDIMMs and four processors (3.0TB per processor).
  • With Persistent Memory in AppDirect mode: Up to 18TB total memory (12TB of Persistent Memory using 24x 512GB PMMs + 6TB of system memory using 24x 256GB 3DS RDIMMs and four processors) (4.5TB per processor)

Note: Support of more than 1.125TB per processor (more than 4.5TB total for a 4-processor system) requires HL-suffix processors. These calculations include any Persistent Memory installed. See the Memory capacity of processors section for more information.

Memory protection ECC, SDDC (for x4-based memory DIMMs), ADDDC (for x4-based memory DIMMs), memory mirroring, and memory sparing.
Disk drive bays Up to 48x 2.5-inch hot-swap drive bays:
  • Up to 48x SAS/SATA drive bays
  • Up to 24x SAS/SATA + 24x NVMe drive bays
  • Up to 24x SAS/SATA + 24x AnyBay drive bays (support SAS or SATA or NVMe drives)

Optional two 7mm hot-swap SSD drive bays at the rear of the server, either SATA or NVMe, for OS boot or storage

Maximum internal storage
  • 368.64 TB using 48x 7.68TB SAS/SATA SSDs
  • 192 TB using 24x 8TB NVMe SSDs
  • 115.2 TB using 48x 2.4TB 2.5-inch HDDs

Mix of NVMe/SSDs/HDDs supported.

Storage controller
  • 8x Onboard SATA ports (Intel VROC SATA RAID, formerly known as Intel RSTe RAID)
  • Up to 16x Onboard NVMe ports (includes Intel VROC NVMe RAID, with optional license for non-Intel NVMe SSDs)
  • NVMe Switch Adapters (no RAID) (also supports Intel VROC)
  • 12 Gb SAS/SATA RAID adapters:
    • RAID 530i-8i (cacheless) supports RAID 0, 1, 10, 5, 50
    • RAID 530i-16i (cacheless) supports RAID 0, 1, 10
    • RAID 930-8i with 2GB flash-backed cache supports RAID 0, 1, 10, 5, 50, 6, 60
    • RAID 930-16i with 4GB flash-backed cache supports RAID 0, 1, 10, 5, 50, 6, 60
    • RAID 940-32i with 8GB flash-backed cache supports RAID 0, 1, 10, 5, 50, 6, 60
  • 12 Gb SAS/SATA non-RAID: 430-8i and 430-16i HBAs
Optical drive bays No internal optical drive.
Tape drive bays No internal backup drive.
Network interfaces Dedicated OCP 3.0 SFF slot with PCIe 3.0 x16 host interface. Supports a variety of 2-port and 4-port adapters with 1GbE, 10GbE and 25GbE network connectivity. One port can optionally be shared with the XClarity Controller (XCC) management processor for Wake-on-LAN and NC-SI support.
PCI Expansion slots

Up to 14 PCIe 3.0 slots plus an OCP 3.0 slot reserved for an Ethernet adapter. Three slots (slots 13, 14, 15) are on the system board and three slots (slots 5, 6, 7) are through a lower riser card. Slots 1, 2, 3, 4 and slots 9, 10, 11, 12 are via upper riser cards that connect to the processors on the processor and memory expansion tray. Slots 1-4 and 9-12 require 4 processors.

The slots are as follows:

  • Slot 1: PCIe x8 FHFL (not present if slot 2 is PCIe x16) (CPU 4)
  • Slot 2: PCIe x8 FHFL or PCIe x16 FHFL double-wide (CPU 4)
  • Slot 3: PCIe x8 FHFL (not present if slot 4 is PCIe x16) (CPU 4)
  • Slot 4: PCIe x8 FHFL or PCIe x16 FHFL double-wide (CPU 4)
  • Slot 5: PCIe x16 FHHL (CPU 2) or PCIe x8 FHHL with 2-slot riser (CPU 2)*
  • Slot 6: PCIe x16 FHHL (CPU 1) or PCIe x8 FHHL with 2-slot riser (CPU 1)*
  • Slot 7: PCIe x16 FHHL (not present if 2-slot riser is selected) (CPU 2)*
  • Slot 8: OCP 3.0 slot with PCIe x16 connection (CPU 2)
  • Slot 9: PCIe x8 FHFL (not present if slot 10 is PCIe x16) (CPU 3)
  • Slot 10: PCIe x8 FHFL or PCIe x16 FHFL double-wide (CPU 3)
  • Slot 11: PCIe x8 FHFL (not present if slot 12 is PCIe x16) (CPU 3)
  • Slot 12: PCIe x8 FHFL or PCIe x16 FHFL double-wide (CPU 3)
  • Slot 13: PCIe x16 LP (CPU 1)
  • Slot 14: PCIe x8 LP (CPU 1)
  • Slot 15: PCIe x8 LP (CPU 1)

* Slots 5, 6 and 7 are implemented using a riser. With a 3-slot riser, all slots are PCIe x16, however this riser is mutually exclusive with 8x NVMe drive connections. Alternatively, a 2-slot riser can be selected (slots 5 & 6, both PCIe x8) which allow the use of the 8x NVMe drive connections. See the System architecture section for a graphical view of the connections.

Ports

Front: One VGA video port. 1x USB 3.1 G1 (5 Gb/s) port, 1x USB 2.0 port. The USB 2.0 port can be configured to support local systems management by using the XClarity Administrator mobile app on a mobile device connected via a USB cable.

Rear: Two USB 3.1 G1 (5 Gbp/s) ports, one VGA video port, one DB-9 serial port, and one RJ-45 XClarity Controller (XCC) systems management port. The serial port can be shared with the XCC for serial redirection functions.

Internal: Optional M.2 adapter in dedicated slot supporting one or two M.2 drives (for OS boot support, including hypervisor support).

Cooling

Eight N+1 redundant hot-swap 60 mm fans (all eight standard). Two additional fans connected to each of the two upper riser units. One additional fan integrated in each of the four power supplies.

Power supply Up to four hot-swap redundant AC power supplies (all 80 PLUS Platinum or Titanium certification): 750 W, 1100 W and 1800 W AC options, supporting 220 V AC. 750 W and 1100 W options also support 110V input supply. In China only, all power supply options support 240 V DC. Power supplies can be configured as N+1 or N+N.
Video G200 graphics with 16 MB memory with 2D hardware accelerator, integrated into the XClarity Controller. Maximum resolution is 1920x1200 32bpp at 60Hz.
Hot-swap parts Drives, fans and power supplies.
Systems management Operator panel with status LEDs and pull-out Integrated Diagnostics Panel with LCD display (pull-out panel is optional in China). Light path diagnostics for local failure detection and reporting. XClarity Controller (XCC) embedded management with remote management (via dedicated management RJ45 port) and local management (via diagnostics panel and via XClarity Mobile app on a mobile device tethered to front USB 2.0 port), XClarity Controller Enterprise enabling remote control functions, XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins, and XClarity Energy Manager centralized server power management.
Security features Chassis intrusion switch, Power-on password, administrator's password, Trusted Platform Module (TPM), supporting TPM 2.0. In China only, optional Nationz TPM 2.0. Lockable top cover.
Operating systems supported Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi.
Limited warranty Three-year or one-year (model dependent) customer-replaceable unit and onsite limited warranty with 9x5 next business day (NBD).
Service and support Optional service upgrades are available through Lenovo Services: 4-hour or 2-hour response time, 6-hour fix time, 1-year or 2-year warranty extension, software support for Lenovo hardware and some third-party applications. Actual offering may depend on the country where the server is installed and is subject to change.
Dimensions Width: 447 mm (17.6 in.), height: 175 mm (6.9 in.), depth: 807 mm (31.8 in.).
Weight Maximum: 62 kg (137 lb)

The SR860 V2 servers are shipped with the following items:

  • Documentation flyer
  • Rail kit (model dependent)
  • Power cords (model and region dependent)

Preview Product Guide: This product guide is a preview version and includes only a subset of a normal server product guide. The SR860 V2 will be orderable in the DCSC configurator in October 2020 and generally available starting in November 2020. Contact your sales rep for more information.

Related product families

Product families related to this document are the following:

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