ThinkSystem SD650Datasheet

30 Jan 2019
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Direct water-cooling technology for a highly efficient data center

Innovative Design

The Lenovo ThinkSystem SD650 dual-node tray is designed for high performance computing (HPC), large-scale cloud, and heavy simulations. It supports workloads from technical computing to grid deployments to analytics and is ideally suited for fields such as research, oil and gas, and engineering. The SD650's unique water-cooling technology provides many key benefits. Compared to other technology, the SD650's direct water cooling: 

  • Reduces data center energy costs by 40%
  • Increases system performance
  • Delivers 90% heat removal efficiency§
  • Creates a quieter data center
  • Enables data center growth without adding CRACs

Maximum Performance/Management

Designed to run the highest core-count Intel® Xeon® Scalable Family processors, the SD650 powers through demanding HPC workloads. Because water cooling removes more heat, CPUs can run in “turbo” mode nonstop, getting up to 10% greater performance from the CPU. For even greater system performance, the SD650 uses 2667MHz DDR4 memory and supports NVMe storage, high-speed EDR InfiniBand, and Omni Path adapters.

The SD650 is managed by Lenovo Intelligent Computing Orchestrator (LiCO), a powerful management suite with an intuitive GUI that helps to easily manage large HPC cluster resources and accelerate development of AI applications. LiCO works with the most common AI frameworks, including TensorFlow, Caffe, MxNet, and Neon.

Extreme Density

One 6U NeXtScale n1200 Enclosure accommodates up to 12 SD650 compute nodes. The enclosure houses up to 24 processors, 9.2TB of memory, 24 SFF SSDs or 12 SFF NVMe drives, and 24 M.2 boot drives. Each SD650 offers up to 12 more cores per U than the previous generation.*

Leading Energy Efficiency

The ThinkSystem SD650’s direct water-cooling design provides extreme energy efficiency. With up to 90% heat removal efficiency, the SD650 provides up to a 40% savings in data center energy expense including:

  • A 25% reduction in annual air conditioning use
  • A 5% energy savings by running CPUs cooler
  • A 4% savings by eliminating fans in the compute nodes

For example, a large super computing center reuses the hot water produced by direct water cooling to save an estimated 45% in electricity costs and uses it to produce chilled water.


Form Factor Full-wide 1U tray (six per n1200 Enclosure)
Chassis NeXtScale n1200 Enclosure (6U)
Processors 2x Intel® Xeon® Scalable Processors per node; 2x nodes per 1U tray
Memory Up to 768GB using 12x 2667MHz TruDDR4 DIMMs per node
I/O Expansion 1x 50mm width ML2 slot and 1x PCIe x16 slot for EDR InfiniBand or Intel Omni Path, per server node
Internal Storage Up to 2x 2.5” SATA SSDs (7mm height) or 1x 2.5” NVMe SSDs (15mm height) per node; optional M.2 SSD Hardware RAID adapter, supporting M.2 drives
RAID Support Onboard SATA controller with Software RAID; optional Dual M.2 SSD adapter with Hardware RAID 1
Network Interface 1x 1GbE BaseT NIC per node; additional high-speed network adapters (InfiniBand or Omni Path) can be installed in available front-accessible PCIe x16 adapter slot
Power Management Rack-level power capping and management via Extreme Cloud Administration Toolkit (xCAT)
Systems Management Remote management using Lenovo XClarity Controller; 1Gb dedicated management NIC plus 1Gb shared management NIC per node
OS Support Red Hat, SUSE, CentOS (with LeSI support); Visit for more information.
Limited Warranty 3-year customer replaceable unit and onsite limited warranty, next business day 9x5, service upgrades available

Featured Options

64GB TruDDR4 2666MHz (4Rx4 1.2V) LRDIMM Memory

Improve server performance and reliability with high-capacity memory

SD650 Intel Xeon Platinum 8160F 24C 160W 2.1GHz Processor

Provides integrated high-speed Omni Path fabric interconnect for HPC clusters

SD650 DWC Intel OPA 100 Series Single-port PCIe 3.0 x16 HFA

Maximize HPC fabric performance and lower power consumption

For More Information

To learn more about the ThinkSystem SD650, contact your Lenovo representative or Business Partner or visit For detailed specifications, consult the Product Guide.

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§ Based on Lenovo internal testing.  * Compared to Lenovo NeXtScale nx360 M5.    

Related product families

Product families related to this document are the following:

© 2019 Lenovo. All rights reserved.
Availability: Offers, prices, specifications and availability may change without notice. Lenovo is not responsible for photographic or typographic errors. Warranty: For a copy of applicable warranties, write to: Lenovo Warranty Information, 1009 Think Place, Morrisville, NC, 27560. Lenovo makes no representation or warranty regarding third-party products or services.

Trademarks: Lenovo, the Lenovo logo, Lenovo XClarity, NeXtScale, ThinkSystem, and TruDDR4 are trademarks or registered trademarks of Lenovo. Intel® and Xeon® are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Other company, product, or service names may be trademarks or service marks of others.

Document number DS0024, published February 20, 2018. For the latest version, go to

ThinkSystem Intel Xeon Platinum Inside