skip to main content

Paul Artman

Paul Artman is a System Architect responsible for delivering innovation into Lenovo HPC and AI systems and for guiding the thermal, mechanical, and power design for Lenovo Infrastructure Solutions Group products. Paul has a Bachelor of Science in Mechanical Engineering (BSME) and Master of Science in Mechanical Engineering (MSME) from the University of Florida and has 20 years of industry experience in thermal, power, and acoustics. He has lead the system architectural design of for several generations of dense server designs and has over 50 issued patents. Paul is a member of ASHRAE TC9.9 and helped define the ASHRAE Environmental Guidelines for Datacom Equipment and is an author of the ASHRAE whitepaper IT Equipment Thermal Management and Controls.

Paul Artman has authored the following document.

All Documents by Paul Artman

The Benefits of Lenovo Thermal Transfer Module Technology in ThinkSystem SD530 Servers (withdrawn)
Article, first published 22 Aug 2018

  • 1-1 of 1